碩士 / 國立虎尾科技大學 / 機械與機電工程研究所 / 97 / Owing to the central processing unit (CPU) Will produce great heat in high-speed computation, damaged CPU caused by heat accumulation and increased high temperature easily happened. Usually CPU will dispose a heat dissipation device, installs the fan additional forces the convection way then increases the convection and reaches the heat dissipation result by the air. A heat dissipation device was configured on a CPU to distribute from increasing hot with a fan, and is utilized commonly nowadays. There is apparent influence even more on whole heat dissipation efficiency in the design and disposition way of the fin.
The purpose of this research is to study the performance of heat sink fin based on the reasonable assumption. A software of finite element named COMSOL Multiphysics is used to solve computation fluid dynamics (CFD). Heat transformation properties of heat sink fin is analyzed. Temperature profile between solid and fluid is defined. Temperature gradation is figured by different meshing technique. And then by improving various kinds of fin slices and comparing. Optimization of the radiator can be obtained base on the performance of radiator analyze.
| Identifer | oai:union.ndltd.org:TW/097NYPI5490026 |
| Date | January 2009 |
| Creators | Yao-Kuei Ciou, 邱耀逵 |
| Contributors | Feng-Tasi Weng, 翁豊在 |
| Source Sets | National Digital Library of Theses and Dissertations in Taiwan |
| Language | zh-TW |
| Detected Language | English |
| Type | 學位論文 ; thesis |
| Format | 83 |
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