碩士 / 大同大學 / 機械工程學系(所) / 97 / As the development of the technology, there are more IC chipsets at the same size or smaller size package we used before. There is more heat and higher temperature should be solved. Engineer need to design an effective Heat Sink for most effectiveness in handling maximum heat dissipation under the limited space.
The purpose of the study is focusing on the Longitudinal Rectangular Heat Sink, which knows the specific fin numbers, one side depth and width of the fin, for determination its thickness and volume. Using the equation of maximum heat dissipating determines the optimum value of the fin thickness then we can also know the optimum volume.
During the computing process, we assume there is no influence from the Fin Tip Convection of the fin in this research. So, it could be ignored during the computation. According to the computing results, we can find the optimum thickness with different Heat Transistor Coefficient, and the thickness we computed has also the best effectiveness. So we can believe the method may be usable for the reference in the designing.
| Identifer | oai:union.ndltd.org:TW/097TTU05311045 |
| Date | January 2009 |
| Creators | Hao-Yuan Cheng, 鄭皓元 |
| Contributors | Hong-Sen Kou, Ji-Jen Lee, 郭鴻森, 李基禎 |
| Source Sets | National Digital Library of Theses and Dissertations in Taiwan |
| Language | zh-TW |
| Detected Language | English |
| Type | 學位論文 ; thesis |
| Format | 69 |
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