A Heat Transfer Analysis of a LED Lamp with Different Fin Array Patterns and Materials / 不同的散熱鰭片幾何形狀及材料對LED嵌燈之熱傳影響分析

碩士 / 中原大學 / 機械工程研究所 / 98 / A high power LED lamp module was simulated by the CFD (Computational Fluid Dynamics) Package Fluent/Icepak in the present study. The basic operating parameters of the lamp were determined by comparing the measurement and simulation data. The temperature distributions of the heat sink used in the lamp were simulated and analyzed by varying the fin shapes and materials of the heat sink.

The power consumption, light flux and the color temperature of the LED lamp are 6.4 watt, 400 lumens and 3000 K, respectively. Three types of heat sinks, which are square pin fins, plate pin fins and square shaped aperture fins, and two materials, ceramic and aluminum were used in the study. Consequently, six heat sink design conditions of the LED lamp were analyzed to obtain the best combination which has the lowest heat sink temperature among these cases.

The results showed that the ceramic heat sink with square aperture fins has the best heat dissipation performance, and both the gap between the fins and the height of the fins also showed significant effects on the heat transfer performance. However, only higher fins have significant effect on the heat transfer performance of the aluminum heat sink. The influence of the shapes and gap of the fins were insignificant. The major difference of the effects on the heat transfer performance of two materials was that the heat transfer of the ceramic heat sink was dominated by radiation, and for the aluminum one was mainly by convection.

Identiferoai:union.ndltd.org:TW/098CYCU5489051
Date January 2010
CreatorsYu-Tang Tzeng, 曾鈺棠
ContributorsCheng-Hsing Hsu, 許政行
Source SetsNational Digital Library of Theses and Dissertations in Taiwan
Languagezh-TW
Detected LanguageEnglish
Type學位論文 ; thesis
Format101

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