碩士 / 國立臺灣海洋大學 / 機械與機電工程學系 / 98 / The objective of this thesis is to investigate the effectiveness of the fin array applied in computers or other electronic equipments by both analytical and numerical analysis in an effort to improve its cooling and avoid overheating.
As modern computer technology advances, The power consumption of its processors also increases and combines with a substantial increase in the chip temperature. The processors should be maintained at a certain temperature for proper operation and long service life. So, it is a major thermal design challenge to transfer waste heat from the chips effectively and avoid heat concentration inside the chips board.
A combination of fin array and fan set up is one of the main thermal technologies in the cooling of micro processors. Several different configurations of fin array, fin geometry, and shapes are investigated so that some guidelines could be achieved in the design and application of fin array.
ANSYS software package and other analytical means are used for the numerical simulation in the thesis. The effects fin array in a different geometry, shape, and size are discussed, which are divided into following:
1. Fin thickness, height, spacing, number of fins, fin material.
2. Different shapes of fin.
3. Optimization in the fin array design.
Another major challenge in the design of fin array is the estimate of convective heat transfer coefficient. Several empirical correlations are used and CFD Fluent software is applied to validate the use of empirical formula. More accurate convective heat transfer coefficient could be obtained through higher computing speed and better experimental data in the future, which will help in the design analysis of fin array.
| Identifer | oai:union.ndltd.org:TW/098NTOU5489015 |
| Date | January 2010 |
| Creators | Ren-Chan Huang, 黃任禪 |
| Contributors | H.Y. Lei, 雷顯宇 |
| Source Sets | National Digital Library of Theses and Dissertations in Taiwan |
| Language | zh-TW |
| Detected Language | English |
| Type | 學位論文 ; thesis |
| Format | 63 |
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