碩士 / 國立虎尾科技大學 / 創意工程與精密科技研究所 / 99 / With the life of electronic products continue to be applied, the role of electronic components because of the heat comes out, will affect the life of electronic products. In recent years, become the focus of the heat sink, in the development of electronic products, if the waste heat can quickly dispersed, is a very important research.
Most of the general manufacturing and aluminum used 5 or 6 series to produce heat sink, but aluminum heat transfer is lower than the aluminum, so, in this study used material is aluminum 1050, and its purity is 99.5% aluminum. First, we use 3D graphics software design geometry of the heat sink, heat sink will be designed to import to the thermal analysis software for thermal analysis, through the post office in that low-temperature values. The next test to get through the material compression properties of materials. Get better by the thermal analysis values obtained with the material test data input into the finite element analysis, metal forming analysis by the heat sink for the form to simulate the forging material in the mold when the plastic deformation pattern, then a better simulation values of production tooling, forging a final experiment to be forging heat sink, and finally the temperature measurements.
| Identifer | oai:union.ndltd.org:TW/099NYPI5785015 |
| Date | January 2011 |
| Creators | Yung-Nan Chen, 陳勇男 |
| Contributors | 楊東昇 |
| Source Sets | National Digital Library of Theses and Dissertations in Taiwan |
| Language | zh-TW |
| Detected Language | English |
| Type | 學位論文 ; thesis |
| Format | 81 |
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