碩士 / 國立高雄應用科技大學 / 模具工程系碩士班 / 101 / Heat sink, lately regarded to as a cooling device, is broadly applied for reducing thermal intensity existing in the electronic or LED applications. Typically, heat sink is designed to increase the surface area to enhance its capacity on the heat dissipations. However, the high powered heat load cannot be effectively dissipated by such the genetic design.
This paper introduces a new ventilated heat sink module(VHSM) which incorporates vent design to help attenuate heat load produced in the heated members. Based on the law of conservation of energy, a fluid flowing from a wider region into a smaller region yields the increase in speed. Therefore, by the proper vent design, the described heat sink module is able to promptly exchange the heat into air and cool the device quickly. This work applies commercial package CFD ANSYS Icepak to investigate the thermal performance of the described heat sink module. Applying the described heat sink module on the analytical LED desk lamp, numerical results indicate that the temperature approaching to the heat source can be reduced from 73°C to 70°C. However, the traditional heat sink can even gain the temperature approximately 5°C, from 73°C to 78°C,comparing with the CFD original LED lamp model. Furthermore, the reduction of temperature can attain approximately 6°C on the location far away from the heat source if one uses the described VHSM to cool the LED lamp. Modeling results demonstrates the validity of the described heat sink module on the heat dissipations.
| Identifer | oai:union.ndltd.org:TW/101KUAS0767004 |
| Date | January 2013 |
| Creators | Yen-Wei Chen, 陳彥瑋 |
| Contributors | Shiang-Jiun Lin, 林香君 |
| Source Sets | National Digital Library of Theses and Dissertations in Taiwan |
| Language | zh-TW |
| Detected Language | English |
| Type | 學位論文 ; thesis |
| Format | 85 |
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