碩士 / 國立臺灣海洋大學 / 輪機工程學系 / 102 / The present study is to analyze the High Power Light Emitting Diode (HI-LED) lamp. Firstly, to investigate the LED heat conductive substrates, we chosen three materials including aluminum, copper, and vapor chamber to analyze through thermocouple measurement of LED temperature and heat conductive substrate temperature. Under the same wattage, the thermal diffusion and illumination properties of the heat conductive substrate are investigated. Finally, we choose the best thermal performance and illumination of heat conductive substrate applied in HI-LED lamps. In HI-LED lamps, mainly through experimental measurement and simulation analysis with the optimal window program design of matrix array fins to calculate the best fin spacing and thickness, the best structure is compared with the prototype in thermal performances in order to establish the process method of LED thermal module under free convection.
Experimental results show that the powers of copper and aluminum measuring up to 11 W, but vapor chamber can measure up to 13 W and the highest illumination of 2018.6273 lm of vapor chamber than 1987.2223 lm of copper and 1910.1506 lm of aluminum under the limitation of 80 °C of the LED maximum temperature and natural convection. Thus, the vapor chamber has the best performance among them. For 150W lamp, the LED maximum temperature is 108 °C under steady state (about one hour). Then, changing the aluminum plate to vapor chamber make the LED maximum temperature dropped to 87.6 °C. Finally, utilizing the optimal fin spacing (8.94 mm) and thickness (2.56 mm) through the optimal window program of fins designed by the present study and CFD simulation can obtain the maximum LED temperature reduce 14 °C (AL base plate module) and 9.74 °C (vapor chamber module), and the total weight percentage reduced improvement of 1.88 %.
For high power 300 W LED lamps, because of the lamps of 30 W lamps consisting (ten modules), firstly, in one piece 30 W LED lamps to the analysis, measuring 30 W LED maximum temperature of 62.2 °C, the original fin spacing and thickness institute into the present window program to calculate the optimal fin spacing of 8.58 mm and thickness of 3.16 mm, the module reduces the total weight percentage of 30.36%, and the LED maximum temperature dropped to 59.1 °C. Then, another aluminum plate replaced the vapor chamber, also found that LED maximum temperature dropped to 56.2 °C. The final analysis of the overall high power 300W lamps, LED maximum temperature measured of 79.2 °C, and will be replaced by the aluminum plate fin improve vapor chamber, LED temperature drops to 66.9 °C, and the total weight percentage reduced improvement of 30.36 %.
| Identifer | oai:union.ndltd.org:TW/102NTOU5484009 |
| Date | January 2014 |
| Creators | Liou,Guan-Cing, 劉冠慶 |
| Contributors | Wang,Jung-Chang, 王榮昌 |
| Source Sets | National Digital Library of Theses and Dissertations in Taiwan |
| Language | zh-TW |
| Detected Language | English |
| Type | 學位論文 ; thesis |
| Format | 133 |
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