碩士 / 元智大學 / 機械工程學系 / 102 / This thesis investigates numerically the chip temperature changes caused by the chip locations of an active heatsink module. Under different conditions, the chip location and the main parameters of heatsink (e.g., base thickness, base area, fin thickness) have been analyzed and compared in order to reduce the highest chip temperature.
It was found that the cooling effect caused by the thinner fin thickness accompanying chip shifts is the best among the cases studied. As the fin thickness reduces, the number of fin increases. Because the total convective area and the associated total heat dissipation increase under this condition, the highest temperature of the chip is relatively low, but with more fins, the channel width between the fins becomes narrower, which results in the increase of air flow resistance. Due to the bypass effect, the temperature distribution is more concentrated, and therefore chip shift will be able to produce more obvious cooling effect.
The results of this study on the chip shift also show that the best location of the chip is not necessarily at the center of the bottom surface of the heat sink. When the space available is limited or the chip location can be asymmetric, the results of this thesis will be available for reference.
| Identifer | oai:union.ndltd.org:TW/102YZU05489041 |
| Creators | Tsung-Cheng Chen, 陳宗成 |
| Contributors | Yur-Tsai Lin, 林育才 |
| Source Sets | National Digital Library of Theses and Dissertations in Taiwan |
| Language | zh-TW |
| Detected Language | English |
| Type | 學位論文 ; thesis |
| Format | 72 |
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