Currently two main tracks are considered for integration of photonic circuits. Silicon based integration may be more cost effective; however implementation of some functionalities like laser, is problematic. In contrast InP offers complete solution of photonic integration including laser diodes. Additionally, much higher speeds may be anticipated from InP based integration. As in the case of ordinary integrated circuits, attempts to increase degree (density) lead to undesired coupling-crosstalk between the components. Three types of cross coupling may be clearly distinguished: optical, RF(electric) and thermal. Each of them has its specifics, physical mechanisms and methods of analysis. Modeling RF crosstalk will be in the focus of this project. To drive active components, such as laser and photodiodes, conducting tracks are integrated with photonic components. In multichannel photonic IC chips these tracks become very dense leading to strong parasitic electrical couplings between them. This crosstalk becomes more problematic in high speed photonic IC chips where the frequency of the RF signals (modulation, detection) is in the range up to 10GHz and beyond. Thus modeling of the crosstalk between RF tracks (also between RF and DC) is of prime importance. This is the main task of the project. A further task is analysis of the crosstalk using developed models and considering designs allowing reduced cross coupling.
| Identifer | oai:union.ndltd.org:UPSALLA1/oai:DiVA.org:liu-110090 |
| Date | January 2014 |
| Creators | Khosravi Nahouji, Mahboobeh |
| Publisher | Linköpings universitet, Institutionen för systemteknik, Linköpings universitet, Tekniska högskolan |
| Source Sets | DiVA Archive at Upsalla University |
| Language | English |
| Detected Language | English |
| Type | Student thesis, info:eu-repo/semantics/bachelorThesis, text |
| Format | application/pdf |
| Rights | info:eu-repo/semantics/openAccess |
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