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Thermal stress behaviors of Al(Cu)/low-k and Cu/low-k submicron interconnect structures

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Identiferoai:union.ndltd.org:UTEXAS/oai:repositories.lib.utexas.edu:2152/10811
Date04 April 2011
CreatorsRhee, Seung-hyun
Source SetsUniversity of Texas
LanguageEnglish
Detected LanguageEnglish
Formatelectronic
RightsCopyright is held by the author. Presentation of this material on the Libraries' web site by University Libraries, The University of Texas at Austin was made possible under a limited license grant from the author who has retained all copyrights in the works., Restricted

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