A full electro-thermal simulation of a three-phase space-vector-modulated (SVM) inverter is performed and validated with measurements. Electrical parameters are extracted over temperature for the insulated gate bipolar transistor (IGBT) and diode electro-thermal models. A thermal network methodology that includes thermal coupling between devices is applied to a six-pack module package containing multiple IGBT and diode chips. The electro-thermal device models and six-pack module thermal model are used to simulate SVM inverter operation at several power levels. Good agreement between model and measurement is obtained for steady state operation of the three-phase inverter. In addition, transient heating of a single IGBT in the six-pack module is modeled and validated, yielding good agreement. / Master of Science
| Identifer | oai:union.ndltd.org:VTETD/oai:vtechworks.lib.vt.edu:10919/36100 |
| Date | 12 January 2006 |
| Creators | Reichl, John Vincent |
| Contributors | Electrical and Computer Engineering, Lai, Jih-Sheng, Lu, Guo-Quan, Hefner, Allen |
| Publisher | Virginia Tech |
| Source Sets | Virginia Tech Theses and Dissertation |
| Detected Language | English |
| Type | Thesis |
| Format | application/pdf |
| Rights | In Copyright, http://rightsstatements.org/vocab/InC/1.0/ |
| Relation | reichl_thesis_final2.PDF |
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