by Shih La Hung Richard. / Thesis submitted in: July 2003. / Thesis (M.Phil.)--Chinese University of Hong Kong, 2004. / Includes bibliographical references (leaves 143-146). / Abstracts in English and Chinese. / Abstract --- p.ii / 論文摘要 --- p.iii / Acknowledgement --- p.iv / Table of Content --- p.vi / List of Figures --- p.xiii / List of Tables --- p.xxii / Chapter Chapter 1 --- Introduction / Chapter 1.1 --- Background of study --- p.1 / Chapter 1.1.1 --- The lead-free movement in electronic industry --- p.1 / Chapter 1.1.2 --- The flip-chip technology --- p.2 / Chapter 1.1.3 --- The using of the lead-free solder for flip-chip application --- p.6 / Chapter 1.2 --- roblems and concerns of lead-free flip-chip technology --- p.7 / Chapter 1.2.1 --- UBM and the tin-copper intermetallic at the UBM/lead-free solder interface --- p.7 / Chapter 1.2.2 --- Tin-nickel intermetallic compound --- p.10 / Chapter 1.2.3 --- The formation of tin-nickel-copper intermetallic compound at the interface of tin-silver-copper bump on nickel UBM --- p.12 / Chapter 1.3 --- Review of the common intermetallic compoundsl --- p.3 / Chapter 1.3.1 --- Tin-copper intermetallic compound --- p.13 / Chapter 1.3.2 --- Tin-nickel intermetallic compound --- p.16 / Chapter 1.3.3 --- Tin-nickel-copper intermetallic compound --- p.18 / Chapter 1.4 --- The motivations and objectives of the study --- p.20 / Chapter Chapter 2 --- Experimentation / Chapter 2.1 --- Introduction --- p.23 / Chapter 2.2 --- Fabrication of wafer bumps --- p.24 / Chapter 2.2.1 --- Wafer lithographyrocess --- p.24 / Chapter 2.2.2 --- Electroplatingrocess --- p.29 / Chapter 2.2.3 --- hotoresist stripping --- p.31 / Chapter 2.2.4 --- Etching of sputtered Cu --- p.33 / Chapter 2.2.5 --- The samplereparation for tin-silver-copper solder --- p.35 / Chapter 2.2.6 --- The reflow of electroplated bumps --- p.35 / Chapter 2.3 --- Additional treatment steps --- p.37 / Chapter 2.3.1 --- Annealing --- p.37 / Chapter 2.3.2 --- Multiple reflow --- p.39 / Chapter 2.3.3 --- Thermal-cycling --- p.39 / Chapter 2.4 --- Characterization --- p.40 / Chapter 2.4.1 --- The cross-section analysis --- p.40 / Chapter 2.4.1.1 --- Samplereparation --- p.40 / Chapter 2.4.1.2 --- Scanning Electron Microscope (SEM) --- p.41 / Chapter 2.4.1.3 --- Scanning Auger Microscope (SAM) analysis --- p.44 / Chapter 2.4.1.3.1 --- The experimental conditions --- p.48 / Chapter 2.4.1.3.2 --- Auger mapping analysis --- p.49 / Chapter 2.4.1.3.3 --- Line scanning analysis --- p.49 / Chapter 2.4.2 --- The reliability test for solder bumps --- p.50 / Chapter 2.4.2.1 --- Measurement of the solder bump's strength --- p.50 / Chapter 2.4.2.2 --- The ball shear test requirements --- p.52 / Chapter Chapter 3 --- The Metallurgy and Stability of the Sn/Cu Interface for Lead-Free Flip-Chip Application / Chapter 3.1 --- Introduction --- p.56 / Chapter 3.2 --- Theroblems of Sn/Cu intermetallic --- p.57 / Chapter 3.3 --- The annealing method and multiple reflow --- p.59 / Chapter 3.3.1 --- The annealing solving approach --- p.59 / Chapter 3.3.2 --- The basic theory of annealing --- p.60 / Chapter 3.3.3 --- Multiple Reflow --- p.63 / Chapter 3.4 --- Results and discussion --- p.63 / Chapter 3.4.1 --- The sample description --- p.63 / Chapter 3.4.2 --- The identification of the components in the structure --- p.64 / Chapter 3.4.3 --- The Sn/Cu intermetallic growth in multiple reflow and the effect of annealing method --- p.68 / Chapter 3.4.3.1 --- The Sn/Cu intermetallic growth for the sample without annealing --- p.68 / Chapter 3.4.3.2 --- The Sn/Cu intermetallic growth for the sample with annealing --- p.71 / Chapter 3.4.3.3 --- Comparison of the Sn/Cu intermetallic growth of the samples with or without annealing --- p.78 / Chapter 3.4.4 --- Interface strength measurement --- p.78 / Chapter 3.4.4.1 --- The ball shear test for the samples after multiple reflow --- p.78 / Chapter 3.4.4.2 --- The ball shear test for the samples after thermal-cycling --- p.82 / Chapter 3.5 --- Conclusion --- p.83 / Chapter Chapter 4 --- Comparison of the metallurgy and Stability of Sn/Ni Intermetallic to Sn/Cu Intermetallic in Flip-Chip Application / Chapter 4.1 --- Introduction --- p.86 / Chapter 4.2 --- The stableroperties of tin-nickel intermetallic --- p.87 / Chapter 4.3 --- Results and Discussion --- p.88 / Chapter 4.3.1 --- Sample Description --- p.88 / Chapter 4.3.2 --- The identification of the components in the structure --- p.88 / Chapter 4.3.3 --- The intermetallic growth of Sn/Ni bumps in multiple reflow --- p.92 / Chapter 4.3.3.1 --- The Sn/Ni intermetallic growth for the sample without annealing --- p.92 / Chapter 4.3.3.2 --- The Sn/Ni intermetallic growth for the sample with annealing --- p.96 / Chapter 4.3.4 --- The comparison tin-nickel intermetallic growth to tin-copper intermetallic --- p.96 / Chapter 4.4 --- Interface strength Measurement --- p.100 / Chapter 4.5 --- Conclusion --- p.102 / Chapter Chapter 5 --- The Formation and Growth of SnNiCu Intermetallic Compound and its Metallurgy and Stability in Flip-Chip Application / Chapter 5.1 --- Introduction --- p.105 / Chapter 5.2 --- The formation of tin-nickel-copper intermetallic --- p.106 / Chapter 5.3 --- Results and Discussion --- p.108 / Chapter 5.3.1 --- Sample Description --- p.108 / Chapter 5.3.2 --- The identification of the components in the structure --- p.108 / Chapter 5.3.2.1 --- For the SnAgCu/Cu interface --- p.108 / Chapter 5.3.2.2 --- For the SnAgCu/Ni interface --- p.110 / Chapter 5.3.3 --- The intermetallic growth of SnAgCu/Cu and SnAgCu/Ni bumps in multiple reflow --- p.115 / Chapter 5.3.3.1 --- The intermetallic growth measurements for SnAgCu/Cu samples --- p.115 / Chapter 5.3.3.2 --- The intermetallic growth measurements for SnAgCu/Ni samples --- p.122 / Chapter 5.3.4 --- The Auger line scanning analysis for both tin-copper and tin-nickel-copper intermetallic --- p.129 / Chapter 5.4 --- Interface strength Measurement --- p.131 / Chapter 5.5 --- Conclusion --- p.139 / Chapter Chapter 6 --- Conclusion / Chapter 6.1 --- Conclusion --- p.140 / References --- p.143
| Identifer | oai:union.ndltd.org:cuhk.edu.hk/oai:cuhk-dr:cuhk_324959 |
| Date | January 2004 |
| Contributors | Shih, La Hung Richard., Chinese University of Hong Kong Graduate School. Division of Chemistry. |
| Source Sets | The Chinese University of Hong Kong |
| Language | English, Chinese |
| Detected Language | English |
| Type | Text, bibliography |
| Format | print, xxiii, 146 leaves : ill. (some col.) ; 30 cm. |
| Rights | Use of this resource is governed by the terms and conditions of the Creative Commons “Attribution-NonCommercial-NoDerivatives 4.0 International” License (http://creativecommons.org/licenses/by-nc-nd/4.0/) |
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