by Dong, Mei. / Thesis (M.Phil.)--Chinese University of Hong Kong, 2007. / Includes bibliographical references (leaves 83-90). / Abstracts in English and Chinese. / INTRODUCTION --- p.1 / Chapter 1.1 --- Bump Height Inspection --- p.1 / Chapter 1.2 --- Our Height Inspection System --- p.2 / Chapter 1.3 --- Thesis Outline --- p.3 / BACKGROUND --- p.5 / Chapter 2.1 --- Wafer Bumps --- p.5 / Chapter 2.2 --- Common Defects of Wafer Bumps --- p.7 / Chapter 2.3 --- Traditional Methods for Bump Inspection --- p.11 / BIPLANAR DISPARITY METHOD --- p.22 / Chapter 3.1 --- Problem Nature --- p.22 / Chapter 3.2 --- System Overview --- p.25 / Chapter 3.3 --- Biplanar Disparity Matrix D --- p.30 / Chapter 3.4 --- Planar Homography --- p.36 / Chapter 3.4.1 --- Planar Homography --- p.36 / Chapter 3.4.2 --- Homography Estimation --- p.39 / Chapter 3.5 --- Harris Corner Detector --- p.45 / Chapter 3.6 --- Experiments --- p.47 / Chapter 3.6.1 --- Synthetic Experiments --- p.47 / Chapter 3.6.2 --- Real image experiment --- p.52 / Chapter 3.7 --- Conclusion and problems --- p.61 / PARAPLANAR DISPARITY METHOD --- p.62 / Chapter 4.1 --- The Parallel Constraint --- p.63 / Chapter 4.2 --- Homography estimation --- p.66 / Chapter 4.3. --- Experiment: --- p.69 / Chapter 4.3.1 --- Synthetic Experiment: --- p.69 / Chapter 4.3.2 --- Real Image Experiment: --- p.74 / CONCLUSION AND FUTURE WORK --- p.80 / Chapter 5.1 --- Summary of the contributions --- p.80 / Chapter 5.2 --- Future Work --- p.81 / Publication related to this work: --- p.83 / BIBLIOGRAPHY --- p.83
| Identifer | oai:union.ndltd.org:cuhk.edu.hk/oai:cuhk-dr:cuhk_325847 |
| Date | January 2007 |
| Contributors | Dong, Mei., Chinese University of Hong Kong Graduate School. Division of Automation and Computer-Aided Engineering. |
| Source Sets | The Chinese University of Hong Kong |
| Language | English, Chinese |
| Detected Language | English |
| Type | Text, bibliography |
| Format | print, x, 90 leaves : ill. ; 30 cm. |
| Rights | Use of this resource is governed by the terms and conditions of the Creative Commons “Attribution-NonCommercial-NoDerivatives 4.0 International” License (http://creativecommons.org/licenses/by-nc-nd/4.0/) |
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