As the electronic industry advances rapidly, the dimensions of the semiconductor products keep on being shrunk and that leads to more stringent requirement on process control and quality assurance. In particular, area array packages like BGA, CSP, flip chips, wafer bumping and wafer-level packaging need to have the 3D quality of some micro-surfaces inspected accurately and efficiently. An example of the micro-surfaces is the solder bumps for direct die-to-die bonding, which are of size as small as 60 to 600 microns in diameter. However, the tiny size and often highly specular and textureless nature of the surfaces make the inspection difficult. In addition, the size of the inspection system is required to be small so as to minimize restraint, on the operation of the various moving parts involved in the manufacturing process. / Experimental results with image data of a variety of objects have positively demonstrated the feasibility of the proposed methodology. / In the mechanism the inspection speed is governed by the number of needed images which also equals the number of spatial shiftings of the grating. This thesis also addresses how the grating, as well as its spatial shifting, can be designed optimally for minimizing this image number for faster inspection speed. An optimal solution to shifting strategy optimization is proposed that is applicable to any pattern on the fringe grating. A design method is also introduced for optimal pattern design, which has higher efficiency than brute-force searching. To reduce image number furthermore, bit-pairing codification mechanism and color-encoded pattern are proposed and verified to be more efficient. / In this thesis, I propose a new methodology for reconstructing micro-surfaces in 3D. The mechanism is based upon the familiar concept of binary structured-light, projection, but adapted, for the purpose of greatly reducing the system size, from the traditional setup of an array of multiple light sources to one with a single light source. The mechanism consists of a single light source in combination with a binary grating for projecting a binary pattern onto the target surface, and of a camera for capturing image of the illuminated scene. By shifting the binary grating in space and in every drifting taking a separate image of the illuminated surface, each position on the illuminated surface will be attached with a string of binary code over the sequence of captured images. With a suitable design of the binary grating, the binary code string can be made unique for each bump surface position, allowing exact correspondence between the binary pattern and image data, and subsequently 3D determination through triangulation. With such a bright-or-dark world for each image position, the issues of image saturation, image noise, and textureless nature of the target surfaces are avoided. / Jun Cheng. / "June 2006." / Adviser: Ronald Chi-kit Chung. / Source: Dissertation Abstracts International, Volume: 67-11, Section: B, page: 6499. / Thesis (Ph.D.)--Chinese University of Hong Kong, 2006. / Includes bibliographical references (p. 107-117). / Electronic reproduction. Hong Kong : Chinese University of Hong Kong, [2012] System requirements: Adobe Acrobat Reader. Available via World Wide Web. / Electronic reproduction. [Ann Arbor, MI] : ProQuest Information and Learning, [200-] System requirements: Adobe Acrobat Reader. Available via World Wide Web. / Abstracts in English and Chinese. / School code: 1307.
| Identifer | oai:union.ndltd.org:cuhk.edu.hk/oai:cuhk-dr:cuhk_343772 |
| Date | January 2006 |
| Contributors | Cheng, Jun, Chinese University of Hong Kong Graduate School. Division of Mechanical and Automation Engineering. |
| Source Sets | The Chinese University of Hong Kong |
| Language | English, Chinese |
| Detected Language | English |
| Type | Text, theses |
| Format | electronic resource, microform, microfiche, 1 online resource (x, 117 p. : ill.) |
| Rights | Use of this resource is governed by the terms and conditions of the Creative Commons “Attribution-NonCommercial-NoDerivatives 4.0 International” License (http://creativecommons.org/licenses/by-nc-nd/4.0/) |
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