Return to search

Aplikace reaktivních nanočástic do SAC pájecí pasty / Reactive Nanoparticles Application to SAC 305 Solder Paste

This work is a research on the topic of reactive nanoparticles and their agitation into the solder paste, which it also describes. It describes in detail the properties of each solder alloys. It explains the creation of intermetallic layers in the soldering process and examines their structure. It also focuses on the evaluation and methodology of testing the properties of solder pastes. In the practical part, individual tests are performed with PF606 and PF610 solder paste.

Identiferoai:union.ndltd.org:nusl.cz/oai:invenio.nusl.cz:377074
Date January 2018
CreatorsMatras, Jan
ContributorsŠpinka, Jiří, Starý, Jiří
PublisherVysoké učení technické v Brně. Fakulta elektrotechniky a komunikačních technologií
Source SetsCzech ETDs
LanguageCzech
Detected LanguageEnglish
Typeinfo:eu-repo/semantics/masterThesis
Rightsinfo:eu-repo/semantics/restrictedAccess

Page generated in 0.0022 seconds