Wireless surface acoustic wave (SAW) sensors offer unique advantages over other sensor technologies because of their inherent ability to operate in harsh environments and completely passive operation, providing a reliable, maintenance-free life cycle. For certain SAW sensor applications the challenge is building a wirelessly interrogatable device with the same lifetime as the SAW substrate. The design of these application intensive sensors is complicated by the degradation of device bond wires, die adhesive, and antenna substrate. In an effort to maximize the benefits of the platform, this dissertation demonstrates wafer-level integrated SAW sensors that directly connect the thin film SAW to a thick film on-wafer antenna. Fully integrated device embodiments are presented that operate over a wide range of temperatures using different fabrication techniques, substrates, and coding principles.
| Identifer | oai:union.ndltd.org:ucf.edu/oai:stars.library.ucf.edu:etd-1669 |
| Date | 01 January 2015 |
| Creators | Gallagher, Mark |
| Publisher | STARS |
| Source Sets | University of Central Florida |
| Language | English |
| Detected Language | English |
| Type | text |
| Format | application/pdf |
| Source | Electronic Theses and Dissertations |
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