The ability to passivate metallic surfaces under non-UHV conditions is not only of fundamental interests, but also of growing practical importance in catalysis and microelectronics. In this work, the passivation effect of a surface iodine layer on air-exposed Ta for the copper electroless deposition was investigated by X-ray photoelectron spectroscopy (XPS) and scanning electron microscopy (SEM). Although the passivation effect was seriously weakened by the prolonged air exposure, iodine passivates the Ta substrate under brief air exposure conditions so that enhanced copper wetting and adhesion are observed on I-passivated Ta relative to the untreated surface.
| Identifer | oai:union.ndltd.org:unt.edu/info:ark/67531/metadc5546 |
| Date | 05 1900 |
| Creators | Liu, Jian |
| Contributors | Kelber, Jeffry A., Braterman, Paul S. |
| Publisher | University of North Texas |
| Source Sets | University of North Texas |
| Language | English |
| Detected Language | English |
| Type | Thesis or Dissertation |
| Format | Text |
| Rights | Use restricted to UNT Community (strictly enforced), Copyright, Liu, Jian, Copyright is held by the author, unless otherwise noted. All rights reserved. |
Page generated in 0.0026 seconds