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Current high power LEDs are used popularly, energy saving can be achieved if the heat transfer performance of a high power LED is increased. Numerical analysis is carried out herein to study the parameters effect on the cooling performance for the heat sinks of the LED projector. The parameters include fin spacing, fin depth, fin thickness, base thickness and flow speed. The numerical results reveal that the parameters of the heat sinks significantly affects the average Nusselt Number. The results of this study can provide design references for LED projector.

CPU heat sinks with high efficiency of heat transfer are greatly demanded for a personal computer with high-speed computational ability. In recent years, the manufacturing technology of CPU heat sinks has got much attention and becomes indispensable for developing the high-performance CPUs.In this study, some different design criteria for the flow guide and die are proposed during an extrusion process with complex cross-sectional shapes, such as CPU heat sinks. The plastic flow pattern of the billet inside the die cavity is analyzed by using a commercial finite element package ¡§DEFORM 3D¡¨.The extrusion load, the stress and strain distribution of die, and the curvature of the product are investigated. Taguchi method is used to find the optimum extrusion condition of the die parameters. In addition, the experiments of extrusion using Al 6061 were carried out. The plastic flow pattern of the billet within the die and the dead metal zones were observed. The experimental data were compared with the analytical values to verify the validity of the proposed analytical models.

A numerical study was carried out for enhanced heat transfer from two heated blocks in a pulsating channel flow by porous heat sink. The flow over the fluid region is governed by the Navier-Stokes equation, and the flow through the porous medium is governed by the Darcy-Brinkman-Forchheimer equation. These two flows are coupled through the interface boundary conditions at the porous/fluid and porous/solid interfaces. After a stream function-vorticity transformation, solution of the coupled governing equations for fluid/porous/solid composite system is obtained using the control-volume-based procedure and hybrid scheme. Comprehensive time-dependent flow and temperature data obtained and averaged over a cycle of pulsation in a periodic steady state. In addition, this study details the effects of variation in the governing parameters, such as inertia parameter, Dracy number, Reynolds number, Strouhal number, pulsation amplitude and geometric parameters, to illustrate important fundamental and practical results. The results show that the periodic change of shape of interblock recirculation flow caused by porous-covering blocks has significant enhanced effect on flow pattern and heat transfer characteristics. This enhanced effect is found to increase with Reynolds number, Strouhal number and pulsation amplitude but decrease with Dracy number. In comparison with the non-porous heat sink case for a steady non-pulsating flow, significant increases in the average Nusselt number are predicted and the instantaneous maximum temperatures within the heated block array are reduced. Moreover, it is shown that specific choices in certain geometric parameters, such as interblock space, can make pronounded change in the cooling of heated block.

Liquid cooled small channel heat sinks have become a promising heat dissipation method for future high power electrical devices. Traditional mini and microchannel heat sinks consist of a single layer of low-aspect ratio rectangular channels. The alternative new heat sinks are fabricated by stacking many channels together to create multiple layer channels. These multilayer heat sinks can achieve high heat flux due to high heat transfer coefficients from small channels and large surface area from multilayer structure. In this research, multilayer copper and silicon carbide (SIC) minichannel heat sinks were tested in single-phase flow. It was shown that multilayer heat sinks have significant advantages over single-layer equivalents with reductions both in thermal resistance and pressure drop. A 3-D resistance network model for single and multilayered heat sinks was developed and validated. Parametric study and optimization on copper and SiC heat sinks with respect to channel geometries, number of layers, and heat sink conductivity were conducted by using the model.Both copper and SiC heat sinks were also tested in two-phase flow. In experiments, the multilayer copper heat sinks achieved smaller average surface temperature than their single-layer counterpart at low heat flux. However the multilayer copper heat sinks gradually lost stability at high heat flux, which lead to increased surface temperature. The redistribution of flow in different layers caused by pressure discrepancy in different layers was believed to be the cause. A three-zone model, which dividing the flow in small channels into three distinguishing parts: single-phase flow, subcooled boiling flow, and saturated boiling flow, was proposed to describe the different two-phase flow regimes. In each zone, the local heat transfer coefficient was computed by corresponding correlation. Several boiling correlations combined with the resistance network model were used to compute the heat sink surface temperature distributions, which were compared with experimental results. It was found the classical boiling correlations for macro channels are not suitable for the minichannels, frequently overestimating the boiling heat transfer coefficient. Boiling correlations for small channels are more consistent with experimental data and the predictions of Yu's correlation match the experimental results best.

This thesis deals with the use of non-metallic highly thermally conductive materials, more concrete-ly special plastic materials, enriched with highly thermally conductive additives, for the purpose of passive cooling of a given heat source. The thesis compares the effectivity of these heat sinks with the classically used materials, specifically aluminium. The thesis is divided into two main sections, theoretical and practical. The theoretical part deals with a constantly growing need of LED (Light Emitting Diode) chips cooling in automotive head-lamps, where the new materials could be put into effect, analyses possible replacement of classic aluminium heat sinks with different materials with a significantly lower thermal conductivity and introduces problems of such materials. The practical part applies the problematic described in the theoretical one on the actually produced heat sinks, which are compared among themselves, with regard to their method of production, as well as with aluminium counterpart in different conditions. Furthermore, the problematic of de-signing a heat sink made from material which is characteristic for its highly anisotropic thermal con-ductivity is dealt with. The end of the thesis shows the importance of heat dissipation via radiation, which can have a great significance in case of plastic heat sinks and in a specific applications.

Yes / This article presents the homotopy perturbation method (HPM) employed to investigate the effects of inclination on the thermal behavior of a porous fin heat sink. The study aims to review the thermal characterization of heat sink with the inclined porous fin of rectangular geometry. The study establishes that heat sink of an inclined porous fin shows a higher thermal performance compared to a heat sink of equal dimension with a vertical porous fin. In addition, the study also shows that the performance of inclined or tilted fin increases with decrease in length–thickness aspect ratio. The study further reveals that increase in the internal heat generation variable decreases the fin temperature gradient, which invariably decreases the heat transfer of the fin. The obtained results using HPM highlights the accuracy of the present method for the analysis of nonlinear heat transfer problems, as it agrees well with the established results of Runge–Kutta. / Supported in part by the Tertiary Education Trust Fund of Federal Government of Nigeria, and the European Union’s Horizon 2020 research and innovation programme under grant agreement H2020-MSCA-ITN-2016SECRET-722424.

Heat pipes are passive heat transfer devices in which a working fluid is sealed inside a metal enclosure. Properly designed wick structures on the inner surface of the heat pipe are critical as the wick aids in the return of the condensed liquid from the cold end back to the hot end where the vaporization-condensation cycle begins again. Additive manufacturing techniques allow for manufacturing complex parts that are typically not feasible with conventional manufacturing methods. Thus, additive manufacturing opens the possibility to develop high performance heat pipes with complex shapes. In this study, an additive manufacturing technique called Binder Jetting is used to fabricate a fully operational compact (78 mm x 48 mm x 8 mm) flat plate heat pipe. Rectangular grooves with converging cross section along the length act as the wicking structure. A converging cross section was designed to enhance the capillary force and to demonstrate the capability of additive manufacturing to manufacture complex shapes. This work describes the challenges associated with the development of heat pipes using additive manufacturing such as de-powdering and sintering. Multiple de-powdering holes and internal support pillars to improve the structural strength of the heat pipe were provided in order to overcome the manufacturing constraints. The heat pipe was experimentally characterized for thermal performance with acetone as the working fluid for two different power inputs. The heat pipe operated successfully with a 25% increase in effective thermal conductivity when compared to solid copper. / Master of Science / The number of transistors in electronic packages has been on an increasing trend in recent decades. Simultaneously there has been a push to package electronics into smaller regions. This increase in transistor density has resulted in thermal management changes of increased heat flux and localization of hotspots. Heat pipes are being used to overcome these challenges. Heat pipes are passive heat transfer devices in which a working fluid is sealed inside a metal enclosure. The fluid is vaporized at one end and condensed at the other end in order to efficiently move heat through the pipe by taking advantage of the latent heats of vaporization and condensation of the fluid. Properly designed wick structures on the inner surface of the heat pipe are used to move the condensed fluid from the cold end back to the hot end, and the wick is a critical component in a heat pipe. Additive manufacturing techniques offer the opportunity to manufacture complex parts that are typically not feasible with conventional manufacturing methods. Thus, additive manufacturing opens the possibility to develop high performance heat pipes with complex shapes as well as the ability to integrate heat exchangers with the heat source. In this study, an additive manufacturing technique called Binder Jetting is used to fabricate a fully operational compact (78 mm x 48 mm x 8 mm) flat plate heat pipe. Rectangular grooves with converging cross section along the length act as the wicking structure. This work describes the challenges associated with the development of heat pipes using additive manufacturing such as depowdering and sintering. The heat pipe was experimentally characterized for thermal performance with acetone as the working fluid for two different power inputs. The heat pipe was found to operate successfully with a 25% increase in effective thermal conductivity when compared with solid copper.