As the time goes by, the more computers become advance, the more heat they produce. If the heat sink of electronic device is not good enough to remove the heat, the electric circuit can be destroyed due to the overheat. This thesis discusses a possible heat sink making of diamond thin layer. Appling the sputtering, Cu thin film has deposited on CVD diamond film, and applying electroplate coating, the thickness of Cu film has increased to 100 µm. In this work a satisfied coating condition has been found to deposite Cu film on diamond, such as: substrate temperature at 300 ¢J, the RF power at 100 Watt and vapor pressure at 2 mTorr for the RF sputtering of Cu on diamond. Using scratch test and pull-off test the adhesion of Cu on diamond has been analyzed to have an adhesive force of 1.9 kg/cm2.Through the simulation with FEMLAB, the finite element method, heat flux, thermal convection and temperature gradient have been simulated. A best thickness of the diamond thin film has been found to be no more thick than 100 µm for the heat sink device.

Abstract With the development of computer processors, the size of chip has become smaller. But the processors used in high-power needs high performance of heat dissipation. In electronic design of the thermal management, the heat sink is the most basic application. Since the natural convection can not cool down effectively, it needs to use the forced convection cooling. The purpose of this study explored water-cooled sink as the heat source for the high-power chip. The study findings show that the ATC cooling chip enhances the potency and decreased the noise. Most importantly, it dissipates heat. In the present study, the researcher used Computational Fluid Dynamics to analyze the heat flow problem. By applying three variables in terms of the flow channel, the housing size, and the heat sink size in data analyses, the researcher classified different types of water-cooled sink. From the discussion of different flow rate and the thermal resistance, it shows that the trend curve of the fin-gilled sink is different from others. It also shows that it performs better in the low flow rate. After all using each method of heat dissipation, the potency of N-type channel sink is the best. When flow rate is 2.2 L/min, the thermal resistance is 0.0971˚C/W.

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Current high power LEDs are used popularly, energy saving can be achieved if the heat transfer performance of a high power LED is increased. Numerical analysis is carried out herein to study the parameters effect on the cooling performance for the heat sinks of the LED projector. The parameters include fin spacing, fin depth, fin thickness, base thickness and flow speed. The numerical results reveal that the parameters of the heat sinks significantly affects the average Nusselt Number. The results of this study can provide design references for LED projector.

CPU heat sinks with high efficiency of heat transfer are greatly demanded for a personal computer with high-speed computational ability. In recent years, the manufacturing technology of CPU heat sinks has got much attention and becomes indispensable for developing the high-performance CPUs.In this study, some different design criteria for the flow guide and die are proposed during an extrusion process with complex cross-sectional shapes, such as CPU heat sinks. The plastic flow pattern of the billet inside the die cavity is analyzed by using a commercial finite element package ¡§DEFORM 3D¡¨.The extrusion load, the stress and strain distribution of die, and the curvature of the product are investigated. Taguchi method is used to find the optimum extrusion condition of the die parameters. In addition, the experiments of extrusion using Al 6061 were carried out. The plastic flow pattern of the billet within the die and the dead metal zones were observed. The experimental data were compared with the analytical values to verify the validity of the proposed analytical models.

A numerical study was carried out for enhanced heat transfer from two heated blocks in a pulsating channel flow by porous heat sink. The flow over the fluid region is governed by the Navier-Stokes equation, and the flow through the porous medium is governed by the Darcy-Brinkman-Forchheimer equation. These two flows are coupled through the interface boundary conditions at the porous/fluid and porous/solid interfaces. After a stream function-vorticity transformation, solution of the coupled governing equations for fluid/porous/solid composite system is obtained using the control-volume-based procedure and hybrid scheme. Comprehensive time-dependent flow and temperature data obtained and averaged over a cycle of pulsation in a periodic steady state. In addition, this study details the effects of variation in the governing parameters, such as inertia parameter, Dracy number, Reynolds number, Strouhal number, pulsation amplitude and geometric parameters, to illustrate important fundamental and practical results. The results show that the periodic change of shape of interblock recirculation flow caused by porous-covering blocks has significant enhanced effect on flow pattern and heat transfer characteristics. This enhanced effect is found to increase with Reynolds number, Strouhal number and pulsation amplitude but decrease with Dracy number. In comparison with the non-porous heat sink case for a steady non-pulsating flow, significant increases in the average Nusselt number are predicted and the instantaneous maximum temperatures within the heated block array are reduced. Moreover, it is shown that specific choices in certain geometric parameters, such as interblock space, can make pronounded change in the cooling of heated block.

Liquid cooled small channel heat sinks have become a promising heat dissipation method for future high power electrical devices. Traditional mini and microchannel heat sinks consist of a single layer of low-aspect ratio rectangular channels. The alternative new heat sinks are fabricated by stacking many channels together to create multiple layer channels. These multilayer heat sinks can achieve high heat flux due to high heat transfer coefficients from small channels and large surface area from multilayer structure. In this research, multilayer copper and silicon carbide (SIC) minichannel heat sinks were tested in single-phase flow. It was shown that multilayer heat sinks have significant advantages over single-layer equivalents with reductions both in thermal resistance and pressure drop. A 3-D resistance network model for single and multilayered heat sinks was developed and validated. Parametric study and optimization on copper and SiC heat sinks with respect to channel geometries, number of layers, and heat sink conductivity were conducted by using the model.Both copper and SiC heat sinks were also tested in two-phase flow. In experiments, the multilayer copper heat sinks achieved smaller average surface temperature than their single-layer counterpart at low heat flux. However the multilayer copper heat sinks gradually lost stability at high heat flux, which lead to increased surface temperature. The redistribution of flow in different layers caused by pressure discrepancy in different layers was believed to be the cause. A three-zone model, which dividing the flow in small channels into three distinguishing parts: single-phase flow, subcooled boiling flow, and saturated boiling flow, was proposed to describe the different two-phase flow regimes. In each zone, the local heat transfer coefficient was computed by corresponding correlation. Several boiling correlations combined with the resistance network model were used to compute the heat sink surface temperature distributions, which were compared with experimental results. It was found the classical boiling correlations for macro channels are not suitable for the minichannels, frequently overestimating the boiling heat transfer coefficient. Boiling correlations for small channels are more consistent with experimental data and the predictions of Yu's correlation match the experimental results best.

This thesis deals with the use of non-metallic highly thermally conductive materials, more concrete-ly special plastic materials, enriched with highly thermally conductive additives, for the purpose of passive cooling of a given heat source. The thesis compares the effectivity of these heat sinks with the classically used materials, specifically aluminium. The thesis is divided into two main sections, theoretical and practical. The theoretical part deals with a constantly growing need of LED (Light Emitting Diode) chips cooling in automotive head-lamps, where the new materials could be put into effect, analyses possible replacement of classic aluminium heat sinks with different materials with a significantly lower thermal conductivity and introduces problems of such materials. The practical part applies the problematic described in the theoretical one on the actually produced heat sinks, which are compared among themselves, with regard to their method of production, as well as with aluminium counterpart in different conditions. Furthermore, the problematic of de-signing a heat sink made from material which is characteristic for its highly anisotropic thermal con-ductivity is dealt with. The end of the thesis shows the importance of heat dissipation via radiation, which can have a great significance in case of plastic heat sinks and in a specific applications.