Abstract
With the development of computer processors, the size of chip has become smaller. But the processors used in high-power needs high performance of heat dissipation. In electronic design of the thermal management, the heat sink is the most basic application. Since the natural convection can not cool down effectively, it needs to use the forced convection cooling.
The purpose of this study explored water-cooled sink as the heat source for the high-power chip. The study findings show that the ATC cooling chip enhances the potency and decreased the noise. Most importantly, it dissipates heat. In the present study, the researcher used Computational Fluid Dynamics to analyze the heat flow problem. By applying three variables in terms of the flow channel, the housing size, and the heat sink size in data analyses, the researcher classified different types of water-cooled sink.
From the discussion of different flow rate and the thermal resistance, it shows that the trend curve of the fin-gilled sink is different from others. It also shows that it performs better in the low flow rate. After all using each method of heat dissipation, the potency of N-type channel sink is the best. When flow rate is 2.2 L/min, the thermal resistance is 0.0971˚C/W.
| Identifer | oai:union.ndltd.org:NSYSU/oai:NSYSU:etd-0812109-165353 |
| Date | 12 August 2009 |
| Creators | Guo, Heng-shen |
| Contributors | Ming-Hwa R., Shyue-Jian Wu, Shi-Pin Ho, Jin-Jhy Jeng |
| Publisher | NSYSU |
| Source Sets | NSYSU Electronic Thesis and Dissertation Archive |
| Language | Cholon |
| Detected Language | English |
| Type | text |
| Format | application/pdf |
| Source | http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0812109-165353 |
| Rights | off_campus_withheld, Copyright information available at source archive |
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