隨著奈米積體電路時代的來臨, 在微影技術,半導體製造技術和電路設計技術的進步已導致新的機會來整合大部份在系統中被使用到的電子功能。例如經過SoC技術提供的單晶片解決方案 - 由可重複使用的矽智財共同構成的單晶片系統 (舉例來說: 微處理器矽智財、數位信號處理矽智財、記憶體矽智財和其他的明星矽智財共同構成的單晶片系統) 可以和其他的整合系統溝通。這種包括多項技術的整合方式漸漸增加DFM 的要求, 進而創造在半導體價值鏈之中新虛擬的整合鏈模式。 對於先進產品發展, 經由現存的分解方式價值鏈﹐從每個單一鏈節 （無晶圓設計，矽智財，電路設計自動化, 設計服務，光罩製造，晶圓製造和封裝／測試）所創造的聯合價值無法在短時間超越IDM (舉例來說: 無法提供較早的上市時間)。因此針對先進產品突破性的發展,整合每個單一鏈節變成重要的主題。本研究針對這一個整合議題提供一個新的設計合作平台作為解決方案。 研究將以 DFM議題在半導體價值鏈中的影響作為分析。針對公司和公司間的溝通界面, 設計合作平台將會提供更多的併進價值鏈知識整合。 / Advances in lithography, semiconductor processes and circuit design techniques at the nanometer IC era have led to new opportunities to integrate most of the electronic functions encountered in systems. The single-chip solution through System on Chip (SoC) which comprises reusable Silicon IP (SIP) such as Microprocessor, Digital Signal Processing (DSP), Memory and other Star SIPs enabling the system to communicate with other systems. This multidisciplinary approach calls for increasing Design for Manufacturing (DFM) needs among semiconductor value chain to enable a whole new virtual integrated chain. Through the existing disintegrated value chain, the synergized value contributed from each single node (fabless, SIP provider, EDA, design service, mask foundry, wafer foundry and assembly/test) could not fulfill the time-to-market benefit as the IDM provides for advanced product development. To integrate each single chain node becomes the important topic for advanced product breakthrough. A new design collaboration platform is proposed to address this integration issue. Study was conducted among this semiconductor value chain for the DFM (Design for Manufacturing) issue. The design collaboration platform addresses the inter-firm communication interface among the value chain to provide more concurrent value chain knowledge integration. By applying Fine’s double helix model with the evidence from DFM case, I successfully predict the re-integration trend of semiconductor industry post the disintegration model.