由於產品微型化的趨勢，與近十年「系統單晶片」(System-on-Chip，SoC)的發展方向截然不同地，「系統構裝晶片」(System-in-Package，SiP) 技術成為為近年新興產業技術，更已成為未來半導體及封測產業重點發展方向。近年來國內外已陸續發表針對「系統構裝晶片」的技術論文或期刊，但大多數的研究文獻僅著重於「系統構裝晶片」的技術，少有對「系統構裝晶片」產品開發者如何進行市場推廣的深入探討。 本研究將從半導體產業現況來說明「系統構裝晶片」的未來發展潛力；接著以「交易成本理論」以及「策略行銷4C架構」做為理論基礎，分析「系統構裝晶片」的產品特性，並進而歸納出「系統構裝晶片」產品的市場行銷策略，以期對於有志從事「系統構裝晶片」產品市場銷售推廣之業者有所助益。 本研究並以「交易成本理論」為根據，指出半導體產業因「系統構裝晶片」的興起而導致可能的演變，以期對於從事產業分析及觀察之有志之士提供一些未來研究觀察之可能方向。 / As a result of the microminiaturization's tendency, with in the recent ten years “System-on-Chip” (SoC) development, “System-in-Package” (SiP) technology which is entirely different for the recent years emergent industry technology, has become the future prioritize direction of the semiconductor and package-and-testing industry. In recent years domestic or foreign paper or the periodical has published one after another aims at “SiP” the technology, however the majority research literature only emphatically on “SiP” techniques, how to explore the market of “SiP” product is still rare to be seen. This research will deviate the future industry development potential of “SiP” from the present situation of semiconductor industry; Then take the “4C framework of Strategic Marketing” as well as the “Transaction Cost Theory” as the rationale to analysis the characteristic of “SiP” product, and then induces the marketing strategy of “SiP” product, hence to provide some guideline of marketing or promotion to those entrepreneurs of “SiP” industry. This research also takes the “Transaction Cost Theory” as the basis, points out the possible evolution of semiconductor industry because of the emerging “SiP” technology, hence to provide some possible direction to those who are devoted to future industry observation and research.