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The Study of Cost-Effective 25 Gb/s Transmitter Optical Sub-Assembly (TOSA) PackagesTseng, Pei-Hao 02 May 2012 (has links)
A cost-effective 25 Gb/s directly-modulated transmitter optical sub-assembly (TOSA) packaging solutions by transistor outline (TO)-Can materials and processes were proposed and demonstrated. The purpose of this dissertation is to develop a high bandwidth TO-Can header for high-speed laser module, to verify a method, to propose a three-version of 25 Gb/s TO-Can laser module packaging, and to analyze in the frequency-domain and time-domain, and to experimentally demonstrate a 25 Gb/s TOSA.
Usually, the transmission bandwidth of a conventional TO-Can laser module is limited below 10 GHz. To overcome this limitation and figure out the solution, firstly, the geometric structure of a conventional TO-56 header was analyzed by using transmission line models and electrical characteristics of the TO-56 header through a three-dimensional electromagnetism full-wave simulation software. The simulated results were in good agreement with the measured results and verify the applicability. Furthermore, we found that the 3-dB bandwidth of a conventional TO-56 header was limited at 16.7GHz. In this study, the first version of TO-Can header V1 was proposed to overcome the problem of the discontinuous impedance. By applying the TO-Can header V1, a TO-Can laser module package was proposed. The electrical characteristics parameters of the TO-Can header V1 were extracted and combined with small-signal equivalent circuit models of laser diode to simulate the electrical characteristics of the entire TO-Can laser module by the circuit simulation tool.
Since bent inside feed-leads and two-step coaxial feed-through holes of the TO-Can header V1 were difficult to achieve in our laboratory equipments, the second version of TO-Can header V2 was proposed and verified experimentally. A 25 Gb/s TO-Can laser module with a matching resistor by adopting the TO-Can header V2 was proposed. The simulated results of this solution by considering with bonding-wires showed that the transmission bandwidth and eye diagram could achieve requirements of 25 Gb/s transmissions.
Finally, the third version of 25 Gb/s TO-Can laser module adopted the TO-Can header V2 and an AlN submount of L-shaped microstrip line was proposed, fabricated, and measured. A DFB LD chip with a 3-dB bandwidth of 21.2 GHz was modeled and used in the simulation and the fabrication. Due to the parasitic effect induced by bonding-wires and die-bonding structure, the variation of high frequency performance of the laser module was simulated comprehensively. By referring to the proposed structure, a TOSA was fabricated by a conventional TO-Can and TOSA fabrication equipments and processes. The measured 3-dB bandwidth of the TOSA was 18.7 GHz. A clear eye diagrams of 25 Gb/s and BER testing for BTB and SMF transmission were obtained. This cost-effective solution of the TOSA is compatible with existing automatic TO-Can process lines and can be fabricated massively. Therefore, the results of this study of proposed TOSA can be applied in the next generation networks of 100GBASE-LR4, OTU4, and 32GFC. The presented simulation and verified technique may provide sufficient estimation and step-by-step analysis to assist the high-speed and high-density optical communication applications and various product developments in the future.
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Filtrace paketů ve 100 Gb sítích / Packet Filtration in 100 Gb NetworksKučera, Jan January 2016 (has links)
This master's thesis deals with the design and implementation of an algorithm for high-speed network packet filtering. The main goal was to provide hardware architecture, which would support large rule sets and could be used in 100 Gbps networks. The system has been designed with respect to the implementation on an FPGA card and time-space complexity trade-off. Properties of the system have been evaluated using various available rule sets. Due to the highly optimized and deep pipelined architecture it was possible to reach high working frequency (above 220 MHz) together with considerable memory reduction (on average about 72% for compared algorithms). It is also possible to efficiently store up to five thousands of filtering rules on an FPGA with only 8% of on-chip memory utilization. The architecture allows high-speed network packet filtering at wire-speed of 100 Gbps.
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Théorie et Pratique de l'Amplificateur Distribué : Application aux Télécommunications Optiques à 100 Gbit/s / Theory and Practice of the Distributed Amplifier : Application to 100-Gb/s Optical TelecommunicationsDupuy, Jean-Yves 17 December 2015 (has links)
La théorie, la conception, l'optimisation et la caractérisation d'amplificateurs distribués en technologie TBDH InP 0,7 µm, pour les systèmes de communications optiques à 100 Gbit/s, sont présentés. Nous montrons comment l'exploitation adaptée du concept d'amplificateur distribué avec une technologie de transistors bipolaires à produit vitesse-amplitude élevé a permis la réalisation d'un driver de modulateur électro-optique fournissant une amplitude différentielle d'attaque de 6,2 et 5,9 Vpp, à 100 et 112 Gbit/s, respectivement, avec une qualité de signal élevée. Ce circuit établit ainsi le record de produit vitesse-amplitude à 660 Gbit/s.V sur tranche et 575 Gbit/s.V en module hyperfréquence. Dans le cadre du projet Européen POLYSYS, il a été associé à un laser accordable et un modulateur pour la réalisation d'un module transmetteur optoélectronique compact, démontrant des performances avançant l'état de l'art des communications optiques courtes distances à 100 Gbit/s. / The theory, design, optimisation and characterisation of distributed amplifiers in 0.7-µm InP DHBT technology, for 100-Gbit/s optical communication systems, are presented. We show how the appropriate implementation of the distributed amplifier concept in a bipolar transistors technology with high swing-speed product has enabled the realisation of an electro-optic modulator driver with 6.2- and 5.9-Vpp differential driving amplitude at 100 and 112 Gb/s, respectively, with a high signal quality. This circuit thus establishes the swing-speed product record at 660 Gb/s.V on wafer and at 575 Gb/s.V in a microwave module. In the frame of the European project POLYSYS, it has been co-packaged with a tunable laser and a modulator to realise a compact optoelectronic transmitter module, which has demonstrated performances advancing the state of the art of short reach 100-Gb/s optical communications.
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