Due to the size of the nano-scale and micro-scale materials, traditional method for measuring the thermal properties of the bulk materials cannot be applied. The 3 OmegaMethod was developed by D. G. Cahill in the early 90s. It was used extensively to measure the thermal properties of thin film dielectric materials. Compare with other simulations or experimental methods, the 3 Omega Method has many advantages. Previous research has indicate that the 3 Omega method is capable of measuring the cross-plane thermal conductivity of thin film materials. In extension, an alternative improvement for measurement of the in-plane thermal conductivity and calculating the difference between the in-plane thermal property and the cross-plane thermal property (anisotropy) are developed based on the concept of the 3 Omega Method.