The fabrication characteristic of focused ion beam (FIB) for Pyrex glass was investigated. FIB has several advantages such as high sensitivity, high material removal rates, low forward scattering, and direct fabrication in selective area without any etching mask, etc. In this study, FIB etched Pyrex glass was used for fast fabrication of 3-D submicron structures. A high-aspect-ratio (HRA) glass structure of 5 (1.97µm depth/0.39µm width) was fabricated. The experimental results in terms of limiting beam size, ion dose¡]ion/cm2¡^, beam current, etc was discussed. Xenon difluoride (XeF2) was applied to enhance the FIB process. Its influence on glass fabrication is studied and characterized.

Focused Ion Beam (FIB) has several advantages such as high sensitivity, high material removal rates, low forward scattering and directing fabrication. Without any etched mask, processing time can be reduced. Pyrex glass etched by FIB is used for fast fabrication of 3-D submicron structure mold. In this study, glass is used as substrate. The UV-cured resin that spin-coated onto a mold has 3-D structure patterns. 3-D structure patterns are transferred on the plate to investigate the effects of parameters of UV cured, pressure and exposure time on the occurrence of defects. The relationship of these processing parameters for the imprinting process is also realized. Besides, the material property of UV-cured resin is investigated. UV-Cured resin is investigated by thermogravimetric Analysis (TGA) to measure the degradation temperature (Td). The hardness and modulus of UV-Cured resin was measured by nanoindentation to realize deformed ability of material for the imprinting process. Moreover, the contact angle of Pyrex glass is measured to investigate its surface quality for the imprint process.