In the electronics industry, several greenhouse gases (GHGs) are used as process gases in manufacturing processes. The organization RF360 as a Qualcomm Inc. subsidiary is using GHGs as input gases in the manufacturing processes dry etching, Chemical Vapor Deposition (CVD) and trimming in the fabrication plant in Munich.The estimation of GHG emissions from the use of process gases under Scope 1 requires a global and comprehensive approach to determine emission sources. This work provides the basis for the GHG emission estimation from process gas use under consideration of the 2019 Refinement to the 2006 IPCC Guidelines for National Greenhouse Gas Inventories. Dry etching and CVD process GHG emissions arecalculated using the Tier 2c method with process specific default emission factors. The process GHG emissions from trimming are characterized under Tier 3a, by determination of site-specific process emission factors. These emission factors are obtained from FTIR measurements in the inline. The measurement results show the input gas NF3 is largely not converted or destroyed in the trimming process. The total GHG emissions resulting from process gas use in the considered processes are determined by emissions of NF3, CF4 and N2O. The implementation and improvement of the approach requires further measurements of site-specific emission factors in the processes and Destruction Removal Efficiencies of the abatement systems.