A castable alloy, i.e., one that flows easily to fill the entire mold cavity and also has resistance to hot tearing during solidification, must invariably contain a sufficient amount of a eutectic structure. For this reason, most traditional aluminum casting alloys contain silicon because the aluminum-silicon eutectic imparts to the alloy excellent casting characteristics. However, the solidus temperature in the Al-Si system does not exceed 577°C, and the major alloying elements (i.e., zinc, magnesium, and copper) used with silicon in these alloys further lower the solidus temperature. Also, these elements have high diffusivity in aluminum and so, while they enhance the room temperature strength of the alloy, they are not useful at elevated temperatures. Considering nickel-base super alloys, whose mechanical properties are retained up to temperatures that approach 75% of their melting point, it is conceivable that castable aluminum alloys can be developed on the same basis so that they are useful at temperatures approaching 350C. A castable aluminum alloy intended for high temperature applications must contain a eutectic structure that is stable at temperatures higher than 600°C, and must contain second phase precipitate particles that are thermodynamically stable at the service temperature. Transition metal trialuminides with the general chemical formula AlxTMy in which TM is a transition metal, are excellent candidates for both the eutectic structure and the precipitate particles. In this research, the use of transition metals in the constitution of aluminum casting alloys is investigated with emphasis on the morphology, crystallography, and mechanisms of formation of the various phases.

Made available in DSpace on 2014-06-12T17:40:06Z (GMT). No. of bitstreams: 2 arquivo7607_1.pdf: 2211073 bytes, checksum: b41804eead923399b6fc86851c635dc3 (MD5) license.txt: 1748 bytes, checksum: 8a4605be74aa9ea9d79846c1fba20a33 (MD5) Previous issue date: 2006 / Este trabalho teve por objetivo estudar alguns tratamentos térmicos para se eliminar ou inibir o processo de estabilização da martensita que é um fenômeno indesejado nas aplicações tecnológicas das ligas com memória de forma, provocando importantes alterações nos fenômenos de memória de forma, resultando em importantes modificações nos comportamentos físicosmecânicos do material. A estabilização da martensita pode ser eliminada ou atenuada através do emprego de tratamentos térmicos específicos ou a utilização de novos elementos de ligas. O estudo do envelhecimento envolve também os comportamentos das interfaces martensita/martensita e austenita/martensita, e da tensão crítica de indução da transformação. Foi estudada uma liga de composição nominal Cu-10%Al-8,4%Mn, que tem temperaturas críticas das transformações martensíticas em torno da temperatura ambiente, obtida a partir da fusão dos elementos químicos num forno de indução de 24 KVa. Amostras foram preparadas para estudo da microestrutura (microscopia ótica), da estrutura cristalina (difração de raios-X), para caracterização das temperaturas de transformação de fase (resistividade elétrica e ensaio de flexão). As amostras foram submetidas aos seguintes tratamentos térmicos de betatização: Têmpera em água a 25°C (BT25), Têmpera em água a 100°C (BT100) e Têmpera ao Ar (BTAr). Em seguida a liga foi caracterizada microestruturalmente apresentando a fase martensítica β 1, que após aquecimento apresenta as características da transformação martensítica inversa, com a fase austenítica ou matriz com estrutura de super-rede DO3. Na difração de raios-X foram obtidas características da fase martensítica β 1, com planos característicos da estrutura ordenada ortorrômbica 18R (β 1). Na resistividade elétrica a baixa temperatura analisou-se o comportamento das curvas de resistividade elétrica versus temperatura, para os diferentes procedimentos de tratamentos térmicos, e a partir das curvas foram determinadas às temperaturas críticas de transformação (AS, AF, MS e MF), as amplitudes térmicas (AT) e as histereses térmicas (HT). Foram realizados ensaios de flexão do tipo viga engastada para simular o efeito memória de forma com uma carga de 13 MPa aplicada à amostra através de um sistema de polia sendo realizada a ciclagem térmica. As curvas da deformação versus temperatura após carregamento da amostra na fase martensítica apresenta uma deformação, em seguida é aquecida e depois resfriada. No aquecimento há um comportamento linear da deformação em função da temperatura. No resfriamento a amostra apresenta um aumento da deformação pseudoplástica. Na resistividade elétrica a alta temperatura verificou-se as modificações nas curvas de temperaturas elevadas onde ocorrem às reações de transição ordem-desordem e de precipitação de fases. Difrações de raios-X foram realizadas a fim de se observar as modificações estruturais da fase martensítica. Os resultados foram analisados em função dos fenômenos da estabilização martensítica tais como supersaturação de lacunas de têmpera e transições ordem-desordem. Os resultados indicam alguns parâmetros que devem ser utilizados para minimizar os problemas causados pelo envelhecimento das ligas Cu-Al-Mn com memória de forma

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No. of bitstreams: 1 santos_cma_dr_araiq.pdf: 6338259 bytes, checksum: b6c2f381dc20c8377b2481a922179786 (MD5) Previous issue date: 2016-08-05 / Coordenação de Aperfeiçoamento de Pessoal de Nível Superior (CAPES) / Neste trabalho os efeitos da variação da concentração de Al sobre as transformações de fase e as propriedades mecânicas das ligas Cu-7%Al-10%Mn-3%Ag, Cu-10%Al-10%Mn- 3%Ag e Cu-11%Al-10%Mn-3%Ag foram estudadas utilizando-se metalografia por microscopias óptica (MO), eletrônica de varredura (MEV) e eletrônica de transmissão (MET), calorimetria exploratória diferencial (DSC), difratometria de raios X (DRX), ensaios de tensão-deformação, análise por dispersão de energias de raios X (EDXS), medidas de variação da resistividade elétrica com a temperatura e medidas de variação da microdureza com a temperatura e o tempo de envelhecimento. Os resultados obtidos para as ligas inicialmente submetidas a tratamento térmico de recozimento e inicialmente submetidas a tratamento térmico de têmpera mostraram que o aumento de 7 para 9%Al não modifica o comportamento térmico e a dureza das ligas Cu-7%Al-10%Mn-3%Ag e liga Cu-9%Al- 10%Mn-3%Ag, pois as curvas obtidas apresentaram o mesmo perfil, indicando que elas passam pelas mesmas transições. Porém, o aumento de 9 para 11%Al provoca uma mudança nas transformações pelas quais a liga passa, modificando assim o seu comportamento térmico e os valores da microdureza. Nas ligas inicialmente recozidas foi possível notar a ocorrência da decomposição espinodal em decorrência da retenção das fases 1 e 3 durante o resfriamento lento das amostras. Os resultados obtidos a partir das ligas submetidas a tratamento térmico de envelhecimento mostraram que aumento da dureza durante este processo está principalmente relacionado à precipitação bainítica. A partir das curvas de variação da microdureza com o tempo de envelhecimento foi possível obter os parâmetros cinéticos (n, k e Ea), utilizando-se as equações de Johnson-Mehl-Avrami-Kolmogorov (JMAK) e Arrhenius. Os valores de energia de ativação obtidos mostraram que o aumento na concentração de Al diminui Ea para o processo de precipitação. A diminuição destes valores deve estar associada principalmente à ocorrência da reação de precipitação de uma fase rica em Ag, que deve ocorrer com razoável intensidade na liga com 7%Al e vai diminuindo até não mais ser detectada na liga contendo 11%Al. Os resultados obtidos pelos testes de tensãodeformação indicaram que as ligas com maior teor de Al são mais frágeis. / In this work, the effects of changes in the Al concentration on the phase transformations and the mechanical properties of the Cu-7%Al-10%Mn-3% Ag, Cu-10%Al-10%Mn-3%Ag and Cu-11%Al-10%Mn-3% Ag alloys were studied using metallography by optical microscopy (OM), scanning electron microscopy (SEM) and electronic transmission mycroscopy (TEM), differential scanning calorimetry (DSC), X-ray diffraction (XRD), stress-strain tests, analysis by X-ray energy dispersing (EDXS), measurements of the variation of electrical resistivity with temperature and microhardness changes measurements with temperature and aging time. The results obtained for alloys initially annealed and initially quenched showed that the increase from 7 to 9% Al does not modify the thermal behavior and hardness of the Cu-7%Al- 10%Mn-3%Ag and Cu-9%Al-10%Mn-3%Ag alloys. However, the increase from 9 to 11%Al causes a change on the transformations of the alloys, thereby modifying their thermal behavior and values of microhardness. In the annealed alloys it was possible to notice the occurrence of the spinodal decomposition due to the retention of 1 and 3 phases during the slow cooling of the samples. The results obtained from aged alloys showed that the hardness increasing observed during this process is mainly related to bainitic precipitation. The isothermal ageing kinetics for this precipitation was studied considering four different ageing temperatures and the kinetic parameters n, k and Ea were obtained using the Johnson-MehlAvrami-Kolmogorov (JMAK) and the Arrhenius equations. The results showed that the increase on the Al concentration decreases the activation energy values for the precipitation process. This should be mainly associated with the occurrence of the precipitation reaction of an Ag-rich phase, that should occur with reasonable intensity in the alloy with 7%Al and decreases until it is no longer detectable in the alloy containing 11%Al. The results obtained for stress-strain testing indicated that the increase in the Al content increases the fragility of the alloys.

A castable alloy, i.e., one that flows easily to fill the entire mold cavity and also has resistance to hot tearing during solidification, must invariably contain a sufficient amount of a eutectic structure. For this reason, most traditional aluminum casting alloys contain silicon because the aluminum-silicon eutectic imparts to the alloy excellent casting characteristics. However, the solidus temperature in the Al-Si system does not exceed 577°C, and the major alloying elements (i.e., zinc, magnesium, and copper) used with silicon in these alloys further lower the solidus temperature. Also, these elements have high diffusivity in aluminum and so, while they enhance the room temperature strength of the alloy, they are not useful at elevated temperatures. Considering nickel-base super alloys, whose mechanical properties are retained up to temperatures that approach 75% of their melting point, it is conceivable that castable aluminum alloys can be developed on the same basis so that they are useful at temperatures approaching 350 °C. A castable aluminum alloy intended for high temperature applications must contain a eutectic structure that is stable at temperatures higher than 600°C, and must contain second phase precipitate particles that are thermodynamically stable at the service temperature. Transition metal trialuminides with the general chemical formula AlxTMy in which TM is a transition metal, are excellent candidates for both the eutectic structure and the precipitate particles. In this research, the use of transition metals in the constitution of aluminum casting alloys is investigated with emphasis on the morphology, crystallography, and mechanisms of formation of the various phases.

Many devices in electronics are in the form of multilayered structures. These structures can fail catastrophically if they contain defects or cracks. Enhancing their fracture properties is therefore critical to improve the reliability of the systems. The interface-dominated fracture mechanics of multilayered structure was studied using experiments and finite element (FE) modeling by considering two examples: thin films on polymer substrates in flexible electronics and Cu leadframe/epoxy molding compound (EMC) in micro-electronics packaging. In the first example, aluminum-manganese (Al-Mn) thin films with Mn concentration up to 20.5 at.% were deposited on polyimide (PI) substrates. A variety of phases, including supersaturated fcc (5.2 at.% Mn), duplex fcc and amorphous (11.5 at.% Mn), and completely amorphous phase (20.5 at.% Mn) were obtained by adjusting alloying concentration in the film. In comparison with crystalline and dual phase counterparts, the amorphous thin film exhibits the highest fracture stress and fracture toughness, but limited elongation. Based on a fracture mechanism model, a multilayer scheme was adopted to optimize the ductility and the fracture properties of the amorphous film/PI system. Tensile deformation and subsequent fracture of strained Al-Mn films on PI were investigated experimentally and by FE simulations. It was found that by sandwiching the amorphous film (20.5 at.% Mn) between two ductile copper (Cu) layers, the elongation can be improved by more than ten times, and the interfacial fracture toughness by twenty four times with a limited sacrifice of the film's fracture toughness (less than 18%). This design provides important guidelines to obtain optimized mechanical properties of future flexible electronics devices. The reliability of amorphous brittle Al-Mn (20.5 at.% Mn) thin films deposited on PI substrates is strongly influenced by the film/substrate interface adhesion. Some strategies to improve the adhesion of the interface were conducted, including roughening the surface of the PI substrate, adding a buffer layer and then tuning its thickness. Tensile testing and FE analysis of amorphous Al-Mn thin films with and without buffer layers coated on intact and plasma etched rough PI were investigated. It was found that by adding a chromium buffer layer of 75 nm on a rough PI substrate, the interface adhesion of the film/substrate can increase by almost twenty times. The obtained results would thus shed light on the interfacial engineering strategies for improving interface adhesion for flexible electronics. In the second example, a systematic investigation and characterization of the interfacial fracture toughness of the bimaterial Cu leadframe/EMC was carried out. Experiments and FE simulations were used to investigate delamination and interfacial fracture toughness of the biomaterial system. Two dimensional simulations using computational fracture mechanics tools, such as virtual crack closure technique, virtual crack extension and J-integral proved to be computationally cheap and accurate to find the interfacial fracture toughness of the bimaterial structures. The effects of temperature, moisture diffusion and mode-mixity on the interfacial fracture toughness were investigated. Testing temperature and moisture exposure significantly reduce the interfacial fracture toughness, and its relationship with the mode-mixity was achieved by fitting the results with an analytic formula.

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