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MODAL ANALYSIS OF MEMS GYROSCOPIC SENSORSBurnie, Marc 03 June 2010 (has links)
Microgyroscopes find popular applications in modern life, such as, vehicle navigation, inertial positioning, human body motion monitoring, etc. In this study, three unique MEMS gyroscopic sensors were investigated using experimental methods and finite element analysis (FEA) modelling, particularly their modal behaviour. The analytical, simulated and experimental results were compared and the discrepancy between resonant frequencies of the significant mode shapes was discussed.
Three microfabricated gyroscopes were investigated: a thermally-actuated in-plane gyroscope, an electrostatically-actuated in-plane gyroscope and an electrostatically-actuated out-of-plane gyroscope. Numerical finite element modal analysis for these three gyroscopes was conducted using COMSOL Multiphysics. The experimental testing was conducted using a microsystem analyzer (MSA-400 PolyTec) with an integrated laser vibrometer.
The simulation models predicted that the frequencies for driving and sensing modes were 4.948kHz and 5.459kHz for a thermally-actuated gyroscope, which agreed well with experimentally determined results of 5.98kHz and 6.0kHz respectively. The power requirements of a thermally-actuated gyroscope were 363.39mW to elicit a maximum peak-to-peak displacement of 4.2μm during dynamic operation. Similarly, the simulated frequencies for the driving and sensing modes were 1.170kHz and 1.644kHz for an electrostatically-actuated in-plane gyroscope, which corresponded to experimentally determined resonant frequencies 1.6kHz and 1.9kHz.
Simulation for the electrostatically-actuated out-of-plane gyroscope was conducted and the frequencies for the driving and sensing modes were found to be 2.159kHz and 3.298kHz. Due to some fabrication defects, the experimental testing for this microgyroscope was not successful. Some recommendations to improve the design were provided for the future work. / Thesis (Master, Mechanical and Materials Engineering) -- Queen's University, 2010-06-02 22:00:52.994
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Design And Analysis Of MEMS Angular Rate SensorsPatil, Nishad 06 1900 (has links)
Design and analysis of polysilicon and single crystal silicon gyroscopes have been carried out. Variations in suspension design have been explored. Designs that utilize in-plane and out-of-plane sensing are studied.
Damping plays an important role in determining the sense response. Reduction in damping directly affects sensor performance. The various damping mechanisms that are prevalent in gyroscopes are studied. Perforations on the proof mass are observed to significantly reduce the damping in the device when operated in air. The effects of perforation geometry and density have been analyzed. The analysis results show that there is a two orders of magnitude reduction in damping of thick gyroscope structures with optimized perforation design.
Equivalent circuit lumped parameter models have been developed to analyze gyroscope performance. The simulation results of these models have been compared with results obtained from SABER, a MEMS specific system level design tool from Coventorware. The lumped parameter models are observed to produce faster simulation results with an accuracy comparable to that of Coventorware
Three gyroscopes specific to the PolyMUMPS fabrication process have been designed and their performance analyzed. Two of the designs sense motion out-of-plane and the other senses motion in-plane. Results of the simulation show that for a given damping, the gyro design with in-plane modes gives a resolution of 4º/s. The out-of-plane gyroscopes have two variations in suspension. The hammock suspension resolves a rate of 25º/s in a 200 Hz bandwidth while the design with folded beam suspension resolves a rate of 2º/s in a 12 Hz bandwidth. A single crystal silicon in-plane gyroscope has been designed with vertical electrodes to sense Coriolis motion. This design gives an order of magnitude higher
Capacitance change for a given rotation in comparison to conventional comb-finger design.
The effects of process induced residual stress on the characteristic frequencies of the polysilicon gyroscopes are also studied. The in-plane gyroscope is found to be robust to stress variations. Analysis results indicate that the tuning fork gyroscope with the hammock suspension is the most susceptible to compressive residual stress, with a significant drop in sensitivity at high stress values.
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