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This thesis focuses on soldering technology in microelectronics. It describes in detail the basic ways of soldering and repairs in electronics. This piece of work shows the principles of technological equipment for bulk soldering and used repairing devices. In the theoretical part of this work there are also briefly described the packages for integrated circuits that were used in the practical part of the thesis. The practical part of the thesis deals with setting of the heat profiles for hot air repair station Fritsch Mikroplacer for LQFP64, SOIC16, TSSOP14, QFN16 and DSBGA5 packages. The heat profiles for assembly and disassembly of the particular types of the packages on designed and manufactured test printed circuit board were set and tested. The resulting heat profiles are compared with the recommended heat profile of an ordinary solder paste SnAg3Cu0,5 which was used for the test. This thesis can serve as an aid for the further settings of heat profiles in other types of packages not only on Fritsch Mikroplacer devices, but also on other repairing devices of this type.

Safety study of refuelling station. Diploma thesis, Institute of Metrology and Quality Assurance Testing, Brno University of Technology. This Diploma thesis deal with quantitative risk assessment of exposure. It means for population, animals and environment stocking, transport and manipulation with vairous fuel at refuelling station in particular area and influence of other industrial effects in close area of this refuelling station. There is more specified a Method of Dow´s fire and explosion Index, method of Guidelines for Quantitative Risk Assessment and method FMEA (Failure Mode and Effect Analysis).