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  • About
  • The Global ETD Search service is a free service for researchers to find electronic theses and dissertations. This service is provided by the Networked Digital Library of Theses and Dissertations.
    Our metadata is collected from universities around the world. If you manage a university/consortium/country archive and want to be added, details can be found on the NDLTD website.

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Wire bond failure Mechanism and microstructure analysis

Jang, Herng-Shuoh 01 July 2002 (has links)
The Au-Al bond is a commonly used interconection in IC package.The different composition for Au wire will change the different IMC growth. In this study, we will discuss the pure Au wire, and little Pd or Cu addition in Au wire reacted with Al pad for thermal aging, and we will give the models for these cases.
Au wire
Kirkendall voids
Cu migration
intermetallic
reliability
Au4Al
peeling off
compound
wire bond
Pd barrier
minute voids
Au5Al2

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