In this study, the reactive rf magnetron sputtering was used to deposit Ba(Zr0.1,Ti0.9)O3 (BZT) ferroelectric thin films on ITO/Glass substrate, and MFM structure was fabricated. The effects of various sputtering parameters on the characteristics of thin films, such as the oxygen concentrations, substrate temperature, rf power and chamber pressure were discussed, and then the optimal sputtering parameters were determined. The annealing process of rapid thermal annealing (RTA) and conventional thermal annealing (CTA) were used to promote the ferroelectric characteristics. The physical characteristics of BZT thin films were obtained by the analyses of SEM, XRD patterns and AFM morphologies. The surfaces, cross-section, crystallization and surface roughness of thin films were discussed. To investigate the electrical properties, the capacitance-voltage (C-V), current-voltage (I-V) and P-E hysteresis characteristics of BZT thin films were measured by the HP4284A impedance analyzer, HP4156C semiconductor parameter analyzer and computerized radiant technology (RT66), respectively. Furthermore, characteristics of the MFM structure were discussed. From the experimental results, the dielectric constant with optimal sputtering parameters was about 84, and the leakage current of thin film was about 6 ¡Ñ 10-8 A/cm2 when the applied electrical field of thin film was at 0.4 MV/cm. The remanent polarization (Pr) and coercive field (Ec) were 2.87 £gC/cm2 and 259 kV/cm from the P-E hysteresis loops, respectively. In addition, the ferroelectric characteristics of the thin film could be improved after rapid thermal annealing at 550¢J for 3 minutes. The remanent polarization (Pr), coercive field (Ec) and saturated polarization (Ps) were 3.42 £gC/cm2, 266 kV/cm and 6.99 £gC/cm2, respectively.