The aim of this thesis is to identify coupling mechanisms for three line microstrip, stripline and microstrip with dielectric overlay structures as either inductive or capacitive, quantify through simulation and measurement the amount of crosstalk to be expected in terms of scattering parameters. A new method of crosstalk suppression is implemented into each three line structure by placing uniformly spaced short circuits down the length of the center transmission line. All structures were simulated over various physical and electrical parameters. Select microstrip structures, shielded and unshielded, were fabricated and measured to validate the effectiveness of the shielding technique. Shielding effectiveness was calculated from the measurements, and their results showed that the isolation between lines was increased by up to 20dB.