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Fabrication of a thin film resistance heaterSathya, Santhana. January 1999 (has links)
Thesis (M.S.)--Ohio University, August, 1999. / Title from PDF t.p.
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Adhesion of sputtered copper to plasma-treated polyimide substances /Ma, Jong-Bong. January 1991 (has links)
Thesis (M.S.)--Rochester Institute of Technology, 1991. / Typescript. Includes bibliographical references.
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Adhesion of copper to photo-oxidized polyimides /Razdan, Mayuri. January 2008 (has links)
Thesis (M.S.)--Rochester Institute of Technology, 2008. / Typescript. Includes bibliographical references (leaves 56-58).
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Properties and characterisation of sputtered ZnO : a thesis presented for the degree of Doctor of Philosophy in Electrical and Computer Engineering at the University of Canterbury, Christchurch, New Zealand /Schuler, Leo P. January 1900 (has links)
Thesis (Ph. D.)--University of Canterbury, 2008. / Typescript (photocopy). "November 2008." Includes bibliographical references (p. [144]-149). Also available via the World Wide Web.
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Effects of sputter deposition parameters on stress in tantalum films with applications to chemical mechanical planarization of copper /Perry, Jeffrey L. January 2004 (has links)
Thesis (M.S.)--Rochester Institute of Technology, 2004. / Typescript. Includes bibliographical references (leaves 74-76).
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Preparation and characterization of granular magnetic cobalt silver thin film.January 2000 (has links)
by Chiah Man Fat. / Thesis submitted in: September 1999. / Thesis (M.Phil.)--Chinese University of Hong Kong, 2000. / Includes bibliographical references (leaves 94-97). / Abstracts in English and Chinese. / Acknowledgements --- p.2 / Abstract --- p.3 / Table of Contents --- p.5 / List of Figures --- p.7 / List of Tables --- p.13 / Chapter Chapter 1 --- Introduction --- p.14 / Chapter 1.1. --- Overview --- p.14 / Chapter 1.2. --- Giant Magnetoresistance (GMR) --- p.15 / Chapter 1.3. --- Application of GMR Materials --- p.20 / Chapter 1.4. --- Preparation Methods --- p.22 / Chapter 1.5. --- This Thesis --- p.23 / Chapter Chapter 2 --- Sample Preparation and Experimental Methods --- p.24 / Chapter 2.1. --- MEVVA Ion Source Implanter --- p.24 / Chapter 2.2. --- The Pulsed Filtered Cathodic Arc Co-deposition System --- p.26 / Chapter 2.3. --- Sample Preparation --- p.29 / Chapter 2.3.1 --- Implantation Condition --- p.29 / Chapter 2.3.2 --- Co-deposition Conditions --- p.31 / Chapter 2.4. --- Characterization methods --- p.32 / Chapter 2.4.1 --- Magnetoresistance Measurement --- p.32 / Chapter 2.4.2 --- Atomic Force Microscopy and Magnetic Force Microscopy --- p.34 / Chapter 2.4.3 --- Rutherford Backscattering Spectroscopy (RBS) --- p.37 / Chapter 2.4.4 --- SQUID Magnetometer --- p.38 / Chapter Chapter 3 --- Characterization of Implanted Samples --- p.39 / Chapter 3.1. --- Introduction --- p.39 / Chapter 3.2. --- Results and Discussion --- p.39 / Chapter 3.2.1 --- Ag Film Thickness Dependence --- p.39 / Chapter 3.2.2 --- Dose Dependence --- p.44 / Chapter 3.2.3 --- Extraction Voltage Dependence --- p.46 / Chapter 3.2.4 --- Annealing Temperature Dependence --- p.49 / Chapter 3.2.5 --- Thicker Layer Formation --- p.56 / Chapter 3.2.6 --- AFM and MFM Measurements --- p.58 / Chapter 3.3. --- Summary --- p.64 / Chapter Chapter 4 --- Characterization of Co-deposited Samples --- p.65 / Chapter 4.1. --- Introduction --- p.65 / Chapter 4.2. --- Results and discussion --- p.65 / Chapter 4.2.1 --- RBS Measurement --- p.65 / Chapter 4.2.2 --- Magnetoresistance Measurement --- p.66 / Chapter 4.2.3 --- AFM Measurement --- p.69 / Chapter 4.2.4 --- MFM Measurement --- p.76 / Chapter 4.3. --- Summary --- p.84 / Chapter Chapter 5 --- Conclusion --- p.85 / Chapter 5.1. --- Main Results of This Work --- p.85 / Chapter 5.2. --- Suggestions on Future Works --- p.87 / Appendix --- p.89 / Reference --- p.94 / Publications --- p.97
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Producao e caracterizacao de filmes finos de SmCoROMERO, SERGIO A. 09 October 2014 (has links)
Made available in DSpace on 2014-10-09T12:45:30Z (GMT). No. of bitstreams: 0 / Made available in DSpace on 2014-10-09T13:56:26Z (GMT). No. of bitstreams: 1
07175.pdf: 4800774 bytes, checksum: 7591ed2b66c61d81600006d10b99afb7 (MD5) / Dissertacao (Mestrado) / IPEN/D / Instituto de Pesquisas Energeticas e Nucleares - IPEN/CNEN-SP
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Producao e caracterizacao de filmes finos de SmCoROMERO, SERGIO A. 09 October 2014 (has links)
Made available in DSpace on 2014-10-09T12:45:30Z (GMT). No. of bitstreams: 0 / Made available in DSpace on 2014-10-09T13:56:26Z (GMT). No. of bitstreams: 1
07175.pdf: 4800774 bytes, checksum: 7591ed2b66c61d81600006d10b99afb7 (MD5) / Dissertacao (Mestrado) / IPEN/D / Instituto de Pesquisas Energeticas e Nucleares - IPEN/CNEN-SP
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Testování a optimalizace iontového zdroje / Testing and optimization of an ion sourceGlajc, Petr January 2014 (has links)
A thorough description of the testing of a saddle-field ion source is presented in the diploma thesis. The most important experimental results, such as Faraday cup measurements of the ion beam current profile and of the ion energy spectra, are included. Based on these results it is shown that the optimized ion source works correctly and according to the expectations. At the end of the thesis, the development of the ion-optical and construction design of the focusing optics is described. The manufactured optics assembly attached to the ion source is also shown.
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Drains thermiques adaptatifs : cuivre allié / Fibre de Carbone / Copper alloys/Carbon fibres : adaptive heat sink materialVeillere, Amélie Aurélie Mylène 29 September 2009 (has links)
Dans le domaine de l'électronique de puissance, la gestion thermique de l'intégration des puces en silicium au sein du système global constitue un problème clé. La chaleur dissipée par les composants électriques est évacuée vers l’extérieur à travers un drain thermique, généralement en cuivre, qui est brasé sur le substrat céramique. Cette étude est consacrée à l'élaboration de drains thermiques adaptatifs en matériaux composites cuivre allié/fibres de carbone (FC) qui combinent une bonne conductivité thermique et un CTE proche de celui du substrat. Dans ce type de matériau, la liaison interfaciale renfort/matrice doit être forte afin d'optimiser le transfert des propriétés entre les deux composants. Le couple cuivre/carbone étant non réactif, un élément d’addition carburigène (Cr ou B) est ajouté à la matrice de cuivre afin de créer cette liaison chimique forte. Un matériau modèle a été réalisé par pulvérisation cathodique afin d’étudier la diffusion de l’élément d’addition au sein de la couche de cuivre vers la zone interfaciale et la formation d’un carbure métallique. Une méthode de chimie des solutions a ensuite été utilisée pour élaborer des poudres de cuivre allié de stœchiométrie donnée. Enfin, les matériaux composites (Cu-B/FC et Cu-Cr/FC) ont été élaborés par métallurgie des poudres et leurs propriétés thermiques et mécaniques corrélées à la microstructure et à la chimie des zones interfaciales / In the field of power electronics, thermal management of silicon chips plays a key role in our ability to increase their performance. Heat generated by the electronic components is dissipated through the heat sink, generally made of Copper that is brazed on to a ceramic substrate. This study focuses on the elaboration of adaptive heat sink material using Copper alloys/Carbon fibers (CF) composite materials which have a good thermal conductivity and a CTE close to the ceramic substrate. In this kind of material, it is necessary to have a strong matrix/reinforcement link in order to optimize transfer properties. Since there is no reaction between Copper and Carbon, a carbide element (Cr or B) is added to the Copper matrix to create this strong chemical bond. A model material has been elaborated by cathode sputtering in order to study the diffusion of the alloying element in the Copper layer and the metallic carbide formation in the interfacial zone. Copper alloy powders, with a given stoichiometry, have also been synthesized by a chemical method. Lastly, composite materials (Cu-B/CF and Cu-Cr/CF) have been elaborated by a powder metallurgy process and their thermal and mechanical properties correlated to the microstructure and the chemistry of the interfacial zones.
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