This thesis is considered about interconnect PCB with microelectronic and electronic modules and continuing on thesis MODERN CAUSES OF ASSEMBLY MICROELECTRONICS AND ELECTRONICS MODULES. This thesis includes, definition of termomechanical strain in solder joints and description of LTCC technology. Practical part includes characterization the causes of assembly with usage chip component and proposal footprint for PCBs, modules and results of temperature cycling of tested modules.

Brittleness of a polymeric material has a direct relationship with the material's performance and furthermore shares an inverse relationship with that material's flexibility. The concept of flexibility of materials has been understood but merely explained with a hand-waving manner. Thus, it has never been defined by a calculation, thereby lacking the ability to determine a definite quantitative value for this characteristic. Herein, an equation is presented and proven which makes determining the value of flexibility possible. Such an equation could be used to predict a material's flexibility prior to testing it, thus saving money and valuable time for those in research and in industry. Substantiating evidence showing the relationship between flexibility of polymers and their respective mechanical properties is presented. Further relating the known tensile properties of a given polymer to its flexibility is expanded upon by proving its relationship to the linear coefficient of thermal expansion for each polymer. Additionally, determining flexibility for polymers whose chemical structures have been compromised by respective solvents has also been investigated to predict a solvent's impact on a polymer after exposure. Polymers examined through literature include polycarbonate (PC), polystyrene (PS), teflon (PTFE), styrene acrylonitrile (SAN), acrylonitrile butadiene styrene (ABS), poly(ethersulfone) (PES), low density polyethylene (LDPE), polypropylene (PP), poly(methyl methacrylate) (PMMA), and poly(vinylidene fluoride) (PVDF). Further testing and confirmation was made using PC, PS, ABS, LDPE, PP, and PMMA.

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