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  • About
  • The Global ETD Search service is a free service for researchers to find electronic theses and dissertations. This service is provided by the Networked Digital Library of Theses and Dissertations.
    Our metadata is collected from universities around the world. If you manage a university/consortium/country archive and want to be added, details can be found on the NDLTD website.
1

Densifica??o e microestrutura de um comp?sito Mo-Cu preparado a partir de um p? de heptamolibidato de am?nia e cobre

Silva, Ronyclei Raimundo da 31 January 2014 (has links)
Submitted by Automa??o e Estat?stica (sst@bczm.ufrn.br) on 2015-12-14T21:40:34Z No. of bitstreams: 1 RonycleiRaimundoDaSilva_DISSERT.pdf: 1911613 bytes, checksum: bc12b6ba49c786087e656fbc0870de75 (MD5) / Approved for entry into archive by Arlan Eloi Leite Silva (eloihistoriador@yahoo.com.br) on 2015-12-17T18:43:16Z (GMT) No. of bitstreams: 1 RonycleiRaimundoDaSilva_DISSERT.pdf: 1911613 bytes, checksum: bc12b6ba49c786087e656fbc0870de75 (MD5) / Made available in DSpace on 2015-12-17T18:43:16Z (GMT). No. of bitstreams: 1 RonycleiRaimundoDaSilva_DISSERT.pdf: 1911613 bytes, checksum: bc12b6ba49c786087e656fbc0870de75 (MD5) Previous issue date: 2014-01-31 / Coordena??o de Aperfei?oamento de Pessoal de N?vel Superior - CAPES / O sistema Mo-Cu ? um comp?sito usado na ind?stria el?trica como material para contato el?trico e resist?ncia de eletrodo de solda assim como dissipador de calor e absorvedor de microondas em dispositivos microeletr?nicos. O emprego desse material em tais aplica??es se deve as excelentes propriedades de condutividade t?rmica e el?trica e a possibilidade de ajuste do seu coeficiente de expans?o t?rmica para satisfazer aqueles dos materiais usados como substratos dos semicondutores na ind?stria micoreletr?nica. A metalurgia do p? atrav?s dos processos de moagem, conforma??o por prensagem e sinteriza??o ? uma t?cnica vi?vel para consolida??o desse tipo de material. Entretanto, a m?tua insolubilidade de ambos as fases e a baixa molhabilidade do Cu l?quido sobre o Mo dificultam a sua densifica??o. A moagem de alta energia ? uma t?cnica de prepara??o de p?s usada para produzir p?s comp?sitos nanocristalinos, com fase amorfa ou solu??o s?lida estendida, os quais aumentam a sinterabilidade de sistemas imisc?veis como o Mo-Cu. Este trabalho investiga a influ?ncia do heptamolibdato de am?nia (HMA) e da moagem de alta energia na prepara??o de um p? comp?sito HMA-20%Cu assim como o efeito desta prepara??o na densifica??o e estrutura do comp?sito Mo-Cu produzido. P?s de HMA e Cu na propor??o de 20% em massa de Cu foram preparados pelas t?cnicas de mistura mec?nica e moagem de alta energia em um moinho planet?rio. Estes foram mo?dos por at? 50 horas. Para observar a evolu??o das caracter?sticas das part?culas, amostras de p?s foram colhidas ap?s 2, 10, 15, 20, 30 e 40 horas de moagem. Amostras cil?ndricas com 5 e 8 mm de di?metro e 3 a 4 mm de espessura foram obtidas por prensagem a 200 MPa tanto para os p?s misturados como para os mo?dos. Tais amostras foram sinterizada a 1200 oC por 60 minutos sob uma atmosfera de H2. Para verificar o efeito da taxa de aquecimento na estrutura do material durante a decomposi??o e redu??o do HMA, foram usadas as taxas de 2, 5 e 10 oC/min.. Os p?s e as estruturas dos corpos sinterizados foram caracterizados por DRX, MO, MEV e EDS. A densidade dos corpos verdes e sinterizados foi medida usando o m?todo geom?trico (massa/volume). Medidas de microdureza vickers com carga de 20 N durante 15 s foram efetuadas nas estruturas sinterizadas. A densidade das estruturas sinterizadas a 10 oC/min. alcan?ou 99 % da densidade te?rica, em quanto a densidade das estruturas sinterizadas a 2 oC/min. atingiu somente 90 % da densidade te?rica. / The Cu-Mo system is a composite used in the electrical industry as material for electrical contact and resistance welding electrode as well as the heat sink and microwave absorber in microelectronic devices. The use of this material in such applications is due to the excellent properties of thermal and electrical conductivity and the possibility of adjustment of its coefficient of thermal expansion to meet those of materials used as substrates in the semiconductor micoreletr?nic industry. Powder metallurgy through the processes of milling, pressing shaping and sintering is a viable technique for consolidation of such material. However, the mutual insolubility of both phases and the low wettability of liquid Cu on Mo impede its densification. However, the mutual insolubility of both phases and the low wettability of liquid Cu on Mo impede its densification. The mechanical alloying is a technique for preparation of powders used to produce nanocrystalline composite powder with amorphous phase or extended solid solution, which increases the sinterability immiscible systems such as the Mo-Cu. This paper investigates the influence of ammonium heptamolybdate (HMA) and the mechanical alloying in the preparation of a composite powder HMA-20% Cu and the effect of this preparation on densification and structure of MoCu composite produced. HMA and Cu powders in the proportion of 20% by weight of Cu were prepared by the techniques of mechanical mixing and mechanical alloying in a planetary mill. These were milled for 50 hours. To observe the evolution of the characteristics of the particles, powder samples were taken after 2, 10, 15, 20, 30 and 40 hours of milling. Cylindrical samples 5 to 8 mm in diameter and 3 to 4 mm thickness were obtained by pressing at 200 MPa to the mixed powders so as to ground. These samples were sintered at 1200 ? C for 60 minutes under an atmosphere of H2. To determine the effect of heating rate on the structure of the material during the decomposition and reduction of HMA, rates of 2, 5 and 10 ? C / min were used .. The post and the structures of the sintered samples were characterized by SEM and EDS. The density of the green and sintered bodies was measured using the geometric method (weight / volume). Vickers microhardness with a load of 1 N for 15 s were performed on sintered structures. The density of the sintered structures 10 ? C / min. reached 99% of theoretical density, how the density of sintered structures to 2 ? C / min. reached only 90% of the theoretical density

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