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NiTiCu is a shape memory alloy that regains its original shape after large amount of shape changing deformation when heated above a critical temperature called reverse martensitic trans-formation temperature( Af). When external load is applied on the sample in twinned martensite phase at low temperature, it deforms by detwinning, accommodating large amount of strains. When it is heated above Af, the shape recovers by transformation of the martensite to austenite phase. However, the amount of shape recovery degrades over time due to internal factors such as precipitates, residual strains and thermal history as well as external factors such as stresses. Severe localized stresses induced by contacts result in plastic deformation that affect the reverse martensitic transformation and hence the shape recovery. In this work, we study how varying levels of contact stresses induced in NiTiCu thin film affect its shape recovery. NiTiCu thin films of six different compositions are deposited on Si(100) wafer by co-sputtering from elemental targets. After deposition, the films are annealed at 500 C for 4 h to make them crystalline. The composition of the films varied linearly with applied power to the targets. Uniformity in composition over a 4 inch substrate area is achieved by substrate rotation. All the films show ne grain microstructure after annealing. The subsurface of the Ni-rich films is columnar. Ni-rich films have annealing cracks and the crack width increases with Ni composition in the films. The roughness of as-deposited films is found to be more for Ni-rich films compared to Ti-rich films. The roughness of the Ni-rich and Ti-rich films increased after annealing. From the X-ray diffraction studies, it was observed that the films are nanocrystalline. Indentation is carried out using a Berkovich diamond indenter with spherical apex, at nine different locations with loads ranging from 0.25 mN to 25 mN. A predefined array is chosen for indentation such that the larger indents act as a guide to precisely locate minute indents generated at lower loads, with residual depth as small as 10 nm, for imaging in high-resolution microscopes like Scanning Electron Microscope as well as in Atomic Force Microscope . In Ti60 (a Ti-rich) lm, the residual indents generated at loads greater than 10 mN show radial cracks originating at corners. Average crack length increases with the maximum load used for generating the indent. Sequential sectioning of Ti48 (a Ni-rich) lm using Focused Ion Beam microscope, revealed that the cracks originate at the lm-substrate interface and reach the surface. In Ti48 lm, residual indents do not show any indentation cracks. The indentation stresses are accommodated by breaking of the columnar structure and the voids between them. Delamination of the film from the substrate is observed on either sides of the indent in both the Ti60 and Ti48 films. The hardness of the films is high at low loads and decrease as the load increases. The deformation by indentation at lower loads is mainly due to detwinning as only the apex of the indenter, which is nearly spherical, is in contact with the sample and the resulting stresses are low. As the load increases, the deformation starts getting accommodated through dislocations along with detwinning as the stress beneath the indenter increases. Spherical cavity model extended to SMA shows that inner hemisphere near the tip contains dislocations where stresses are very high, surrounded by detwinned region with stresses that are relatively low. When the sample is heated above reverse martensitic transformation temperature to induce shape recovery in the indents, only the detwinned region recovers to the original shape. Recovery ratio, quantification of shape recovery, is calculated from the depth of the indents before and after heating. Recovery ratio in Ti60 films is found to be large at low loads and decreases with increase in load. The decrease in shape recovery in Ti60 is attributed to the increase in the amount of plastic deformation at the expense of detwinning. Three-dimensional mapping of the surfaces shows that the recovery ratio is high at the apex of the indent at the maximum depth and reduces towards the edges of the indent. There is no evident recovery in Ti48 films. The shape recovery of SMAs can be achieved by Joule heating. When electric current is passed through the material, it heats up by Joule heating because of the intrinsic resistivity. The resistivity and hence the resistance would get effected by the dislocation based plastic deformation induced by the contact. This might result in shape recovery through resistive heating. Towards understanding this, the effect of contact stresses on electrical contact resistance is studied. Experimental setup is designed, developed and calibrated for studying the variation of electrical contact resistance of the NiTiCu thin films as a function of load. Electrical contact resistance is found to decrease with increase in applied load. Contact stresses in sub-micron NiTiCu thin films are simulated by carrying out nanoindentation at different loads. The recovery ratio is high when the stresses induced by the contact is less, at lower loads. The shape recovery ratio is reduced when the induced contact stresses in-creases. There is no shape recovery at the sharp edges of the indentation where contact stresses are very high. Hence, by carefully designing the features to reduce the stress concentrations, the performance of the device can be improved.

The increasing demand for nearline storage capacity in data centers calls for a continued enhancement in hard disk drive recording density far beyond one terabit per square inch. The thermal stability limit forces the drive manufacturers to develop new concepts in order to achieve this in the long term. Potential solutions are microwave-assisted magnetic recording (MAMR), heat-assisted magnetic recording (HAMR) and bit-patterned media (BPM). A simple example of BPM based on sputter-deposited Co/Pd multilayers and prepatterned substrates at hypothetical recording densities up to one terabit per square inch was studied by magnetic force microscopy (MFM). This system achieved promising results at lower densities, but an actual application for data storage, especially at one terabit per square inch and higher densities, requires elaborate optimizations. For some time now, FePt thin films have attracted much attention as prospective recording layers for high-density magnetic data storage due to their high magnetic anisotropy. The use of FePt films in HAMR is especially promising. This application has been tested successfully by Seagate and its key customers in recent years and is about to be introduced into the nearline hard disk drive market. It requires a tuning of the magnetic properties of FePt, especially of its Curie temperature. The addition of Cu proved to be effective in this regard and can also facilitate the formation of the crucial L10 structure and (001) texture during rapid thermal annealing of sputter-deposited thin films. Such films were prepared as bilayers of Cu and FePt on Si substrates, annealed for 30 s, and analyzed by X-ray diffraction (XRD) and SQUID vibrating sample magnetometry (SQUID-VSM). The influence of large Cu additions on important properties like lattice parameters, mosaicity, magnetic anisotropy and Curie temperature is discussed. The chemical long-range order was calculated from the XRD data, and a dedicated chapter of this thesis covers the most important factors to be considered in such calculations for textured thin films and other samples. The feasibility of creating patterned Fe-Cu-Pt films with perpendicular magnetic anisotropy, as needed for a combination of HAMR and BPM, by deposition through a PMMA mask, a lift-off process and subsequent annealing was investigated as well. The results indicate that the chosen approach might not lead to the required (001) texture when the nanostructures are small enough to compete with today's recording densities, so that either a continuous film might need to be etched after annealing or a seed layer might be required to induce the texture.:1. Motivation: Magnetic Data Storage 2. Experimental Techniques 3. Co/Pd Multilayers on Prepatterned Substrates 4. Fe-Pt and Fe-Cu-Pt Alloys 5. Rapid Thermal Annealing of FePt and FePt/Cu Films 6. Order Parameter Calculation 7. Summary