A sustainable electroless copper coating process was developed for plating automotive fasteners shaped from AISI 9255 low carbon, high silicon steel. The objective was to minimize the ionic and organic species present in each step of the plating process. A sulfuric acid solution inhibited with quinine was defined to clean the steel prior to plating. The corrosivity of the solution was examined through electrochemical and weight loss measurements to evaluate the efficiency of the cleaning process at high temperatures and high acid concentrations. An electroless copper coating process was then developed using a simple copper sulfate chemistry inhibited with quinine to extend the possible operating window. Finally, benzotriazole was evaluated as a possible anti-oxidant coating. Accelerated thioacetamide corrosion tests were used to evaluate the corrosion inhibition of benzotriazole on copper coatings.

A sustainable electroless copper coating process was developed for plating automotive fasteners shaped from AISI 9255 low carbon, high silicon steel. The objective was to minimize the ionic and organic species present in each step of the plating process. A sulfuric acid solution inhibited with quinine was defined to clean the steel prior to plating. The corrosivity of the solution was examined through electrochemical and weight loss measurements to evaluate the efficiency of the cleaning process at high temperatures and high acid concentrations. An electroless copper coating process was then developed using a simple copper sulfate chemistry inhibited with quinine to extend the possible operating window. Finally, benzotriazole was evaluated as a possible anti-oxidant coating. Accelerated thioacetamide corrosion tests were used to evaluate the corrosion inhibition of benzotriazole on copper coatings.

A sustainable electroless copper coating process was developed for plating automotive fasteners shaped from AISI 9255 low carbon, high silicon steel. The objective was to minimize the ionic and organic species present in each step of the plating process. A sulfuric acid solution inhibited with quinine was defined to clean the steel prior to plating. The corrosivity of the solution was examined through electrochemical and weight loss measurements to evaluate the efficiency of the cleaning process at high temperatures and high acid concentrations. An electroless copper coating process was then developed using a simple copper sulfate chemistry inhibited with quinine to extend the possible operating window. Finally, benzotriazole was evaluated as a possible anti-oxidant coating. Accelerated thioacetamide corrosion tests were used to evaluate the corrosion inhibition of benzotriazole on copper coatings.

A sustainable electroless copper coating process was developed for plating automotive fasteners shaped from AISI 9255 low carbon, high silicon steel. The objective was to minimize the ionic and organic species present in each step of the plating process. A sulfuric acid solution inhibited with quinine was defined to clean the steel prior to plating. The corrosivity of the solution was examined through electrochemical and weight loss measurements to evaluate the efficiency of the cleaning process at high temperatures and high acid concentrations. An electroless copper coating process was then developed using a simple copper sulfate chemistry inhibited with quinine to extend the possible operating window. Finally, benzotriazole was evaluated as a possible anti-oxidant coating. Accelerated thioacetamide corrosion tests were used to evaluate the corrosion inhibition of benzotriazole on copper coatings.

Thesis (M. Phil.)--University of Hong Kong, 1979.

published_or_final_version / Chemistry / Master / Master of Philosophy

No description available.

No description available.

Thesis (Ph. D.)--University of Washington, 1997. / Vita. Includes bibliographical references (leaves [119]-126).

The object of this investigation was to study the properties of copper electrodeposits on carbon, to compare the various methods of electrodeposition as to adhesion to the carbon, nature of the interface, polishability, solderability, effect of the carbon surface, effect of temperature of plating, and to determine a suitable etching solution for the electrodeposited copper. The carbon samples that were used were approximately three-eighths of an inch in diameter and three inches long. Each sample was plated with copper from copper cyanide, copper strike, and copper sulfate plating solutions. The thicknesses of the electrodeposits from the cyanide copper plating solution were 0.0005, 0.001, and 0.002 inches. The temperature of the copper cyanide plating solution was varied from 49 to 70°C for the tests. The surfaces of the carbon rods that were used were smooth, rough, and very rough, relative only to one another. The forces required to break the adhesion between the copper electrodeposits and the carbon rods were determined as a function of the thickness of the electrodeposits, temperature of the copper cyanide plating solution, nature of the carbon surface, and the particular plating solution used. Also the polishability and solderability of the copper electrodeposits were determined, The force required to break the adhesion between the copper electrodeposit and the carbon red increased from 76 to 265 pounds per square inch for electrodeposit thickness increasing from 0.0005 to 0.002 inches. The force required to break the adhesion between the copper electrodeposit and the carbon rod varied from 220 pounds per square inch for a plating temperature of 60°C, to 249 pounds per square inch for a plating temperature of 70°C, and to 274 pounds per square inch for a plating temperature of 49°C. The force required to break the adhesion between the copper electrodeposit and the carbon rod was 220 pound per square inch for the smooth surface of the carbon, 18o pounds per square inch for the rough carbon surface, and 235 pounds per square inch for the very rough carbon surface. The force required to break the adhesion between the copper electrodeposit and the carbon surface was 220 per square inch for the copper cyanide solution, 326 pound per square inch for the copper strike solution, and 100 pounds per square inch for the copper sulfate solution. The copper deposited from the copper cyanide solution polished to a bright shine and was easily soldered for the adhesion tests. The interface between the copper electro-deposit and the carbon red plainly showed the that electro-deposits filled the irregular voids on the carbon surface, the etchant best suited for use with the copper electro-deposits was determined to be the solution composed of potassium bichromate, sodium chloride, concentrated sulfuric acid, and distilled water. / B.S.