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Whisker growth in electro-plated tin on copper. / 電鍍錫在銅質底材上晶鬚生長的硏究 / Whisker growth in electro-plated tin on copper. / Dian du xi zai tong zhi di cai shang jing xu sheng chang de yan jiuJanuary 2001 (has links)
by Chan To = 電鍍錫在銅質底材上晶鬚生長的硏究 / 陳濤. / Thesis (M.Phil.)--Chinese University of Hong Kong, 2001. / Includes bibliographical references. / Text in English; abstracts in English and Chinese. / by Chan To = Dian du xi zai tong zhi di cai shang jing xu sheng chang de yan jiu / Chen Tao. / Abstract --- p.i / 論文摘要 --- p.ii / Acknowledgements --- p.iii / Table of Content --- p.v / Chapter Chapter 1 --- INTRODUCTION / Chapter 1.1 --- Lead-free movement and the problem of whisker --- p.1-1 / Chapter 1.2 --- Properties of tin and tin-copper intermetallics --- p.1-2 / Chapter ´Ø --- Tin --- p.1-2 / Chapter ´Ø --- Tin-copper intermetallics --- p.1-2 / Chapter 1.3 --- Literature Review of Whisker --- p.1-4 / Chapter 1.3.1 --- Feature of the whisker --- p.1-4 / Chapter 1.3.2 --- Conditions prone to whisker growth --- p.1-8 / Chapter 1.3.3 --- Growth mechanism of the whisker --- p.1-10 / Chapter 1.3.4 --- Methods to prevent or remove whisker --- p.1-11 / Chapter 1.4 --- Motivation & Aims of Studies --- p.1-12 / Chapter Chapter 2 --- EXPERIMENTAL & INSTRUMENTATION / Chapter 2.1 --- Sample Preparation --- p.2-1 / Chapter ´Ø --- Electroplating process --- p.2-1 / Chapter 2.2 --- Instrumentation --- p.2-6 / Chapter 2.2.1 --- Scanning Auger Microscope (SAM) analysis --- p.2-6 / Chapter ´Ø --- Experimental conditions --- p.2-9 / Chapter ´Ø --- Sample preparation for Auger analysis --- p.2-10 / Chapter ´Ø --- Depth profile analysis --- p.2-11 / Chapter ´Ø --- Mapping --- p.2-11 / Chapter ´Ø --- Line scan --- p.2-12 / Chapter 2.2.2 --- X-ray diffractometer (XRD) --- p.2-12 / Chapter 2.2.3 --- Scanning Electron Microscope (SEM) --- p.2-13 / Chapter Chapter 3 --- INFLUENCE OF CATHODIC/ANODIC ELECTROCHEMICAL CLEANING ON THE WHISKER GROWTH / Chapter 3.1 --- Introduction --- p.3-1 / Chapter 3.2 --- Theory --- p.3-2 / Chapter ´Ø --- Reactions occurring at the anode/cathode --- p.3-3 / Chapter 3.3 --- Sample description --- p.3-5 / Chapter 3.4 --- Results and discussion --- p.3-5 / Chapter ´Ø --- Surface morphology before electroplating --- p.3-5 / Chapter ´Ø --- Whisker observation --- p.3-7 / Chapter 3.5 --- Summary --- p.3-18 / Chapter Chapter 4 --- INFLUENCE OF COPPER CONCENTRATION IN THE PLATING BATH ON COPPER DIFFUSION AND WHISKER FORMATION / Chapter 4.1 --- Introduction --- p.4-1 / Chapter 4.2 --- Theory and Literature Review --- p.4-2 / Chapter ´Ø --- Diffusion kinetic --- p.4-2 / Chapter ´Ø --- Influence of solute atoms --- p.4-5 / Chapter 4.3 --- Sample description --- p.4-6 / Chapter 4.4 --- Results and discussion --- p.4-6 / Chapter ´Ø --- SEM observations --- p.4-6 / Chapter ´Ø --- Cross-sectional analysis --- p.4-8 / Chapter ´Ø --- Surface and depth profile analysis --- p.4-15 / Chapter ´Ø --- XRD analysis --- p.4-21 / Chapter 4.5 --- Summary --- p.4_24 / Chapter Chapter 5 --- ANNEALING EFFECT ON THE WHISKER GROWTH / Chapter 5.1 --- Introduction --- p.5-1 / Chapter 5.2 --- Theory and Literature Review --- p.5-2 / Chapter 5.3 --- Sample description --- p.5-3 / Chapter 5.4 --- Results and discussion --- p.5-4 / Chapter ´Ø --- SEM whisker observation --- p.5-4 / Chapter ´Ø --- Cross-sectional Auger analysis --- p.5-4 / Chapter ´Ø --- Surface and depth profile analysis --- p.5-16 / Chapter 5.5 --- Summary --- p.5-27 / Chapter Chapter 6 --- FORMATION MECHANISM OF THE STRIATION ON WHISKER / Chapter 6.1 --- Introduction --- p.6-1 / Chapter 6.2 --- Results and discussion --- p.6-2 / Chapter ´Ø --- Texture of the striation --- p.6-2 / Chapter ´Ø --- Time evolution in the surface morphology --- p.6-6 / Chapter ´Ø --- Stage of whisker growth --- p.6-6 / Chapter 6.3 --- Summary --- p.6-12 / Chapter Chapter 7 --- CONCLUSIONS & FUTURE STUDIES / Chapter 7.1 --- Conclusions --- p.7-1 / Chapter 7.2 --- Future studies --- p.7-3 / Reference
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