The role of bonding in the tensile creep behavior of paper was analyzed. This was accomplished by producing handsheets at a range of different bonding levels through manipulation of relative bonded area and specific bond strength. This was done by varying the level of wet pressing (to change relative bonded area) and using debonding and bonding agents (to change specific bond strength). Once manufactured, sheets underwent an extensive battery of physical testing and creep testing. Creep testing was conducted under constant humidity and cyclic humidity (accelerated creep) conditions. Microscopic analysis techniques were also employed to visually study bonded area loss from creep strain. Two mathematical models (one empirical and one rheological) were created to isolate, account for, and incorporate bonding into predicting tensile creep behavior in paper. Overall, the results from this thesis show that the role of bonding in tensile creep behavior (and accelerated creep behavior) is no different than its role in stress-strain behavior, which is a new finding. This means the bonding influence on tensile creep behavior is related to sheet efficiency and how effectively stress is distributed within the structure, bonded area loss is a strain-induced phenomenon and bonding is not the cause of accelerated creep behavior.

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