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  • About
  • The Global ETD Search service is a free service for researchers to find electronic theses and dissertations. This service is provided by the Networked Digital Library of Theses and Dissertations.
    Our metadata is collected from universities around the world. If you manage a university/consortium/country archive and want to be added, details can be found on the NDLTD website.
1

The Fabrication of Flexible Substrate Using BaTi4O9/Polymer Composites for High Frequency Application

Lee, Yi-Chih 31 July 2007 (has links)
The flexible substrate was fabricated by BaTi4O9 mixed with O-Cresol Novolac Epoxy, polyether imide or surface active agents. The electrical and physical characteristic measured had been finished. The dielectric property influence of substrate was changed from percentage of BaTi4O9. The dielectric constant model was used by Jayasundere and Smith equation (J. S. eq.) and Lichtenecker equation (L. eq.) The study of crystalline grain, orientation and phase transfer temperature was used by SEM, XRD, and DSC, respectively. The dielectric constant and dielectric loss tangent of the composite was measured using an HP4294A impedance analyzer. The TM mode calculated by resonate frequency of the composite was measured using an HP4156C network analyzer. The dielectric constant was obtained to TM mode at high frequency. The result was showed that dielectric constant at low frequency of BaTi4O9, OCN Epoxy and PEI are 57, 5.8 and 3.65, respectively. OCN Epoxy is better than PEI of electrical characteristic. However, OCN Epoxy is not flexible. For this reason, the PEI was focused on electrical property at high frequency. The BaTi4O9 exhibited a dielectric constant of 39 at frequency during 3~10 GHz. The dielectric constant was measured of 10 at frequency during 2~16 GHz with 70 wt% PEI composite. The dielectric constant is higher than FR-4 substrate to 6.4 of the composite. The low dielectric constant is obtaining to reduce stuffing.
2

Cresol Novolac/Epoxy Networks: Synthesis, Properties, and Processability

Lin-Gibson, Sheng 27 April 2001 (has links)
Void-free phenolic networks have been prepared by the reaction of phenolic novolac resins with various diepoxides. The stoichiometric ratio can be adjusted to achieve networks with good mechanical properties while maintaining excellent flame retardance. A series of linear, controlled molecular weight, 2,6-dimethylphenol endcapped cresol novolac resins have been synthesized and characterized. The molecular weight control was achieved by adjusting the stoichiometric ratio of cresol to 2,6-dimethylphenol and using an excess of formaldehyde. A dynamic equilibrium reaction was proposed to occur which allowed the targeted molecular weight to be obtained. A 2000 g/mol ortho-cresol novolac resin was crosslinked by a diepoxide oligomer and by an epoxidized phenolic oligomer in defined weight ratios and the structure-property relationships were investigated. The networks comprised of 60 or 70 weight percent cresol novolac exhibited improved fracture toughness, high glass transition temperatures, low water uptake, and good flame retardance. The molecular weights between crosslinks were also determined for these networks. The stress relaxation moduli were measured as a function of temperature near the glass transition temperatures. Crosslink densities as well as the ability to hydrogen bond affect the glassy moduli of these networks. Rheological measurements indicated that cresol novolac/epoxy mixtures have an increased processing window compared to phenolic novolac/epoxy mixtures. Maleimide functionalities were incorporated into cresol novolac oligomers, and these were crosslinked with bisphenol-A epoxy. The processability of oligomers containing thermally labile maleimides were limited to lower temperatures. However, sufficiently high molecular weight oligomers were necessary to obtain good network mechanical properties. Networks prepared from 1250 g/mol cresol novolac containing maleimide functionilities and epoxy exhibited good network properties and could be processed easily. Latent triphenylphosphine catalysts which are inert at processing temperatures (~140°C) but possess significant catalytic activity at cure temperatures 180-220°C were necessary for efficient composite fabrication using phenolic novolac/epoxy matrix resins. Both sequestered catalyst particles and sizings were investigated for this purpose. Phenolic novolac/epoxy mixtures containing sequestered catalysts exhibited significantly longer processing time windows than those containing free catalysts. The resins also showed accelerated reaction rates in the presence of sequestered catalysts at cure temperatures. Trihexylamine salt of a poly(amic acid) was sized onto reinforcing carbon fibers and the composite properties indicated that fast phenolic novolac/epoxy cure could be achieved in its presence. / Ph. D.

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