International Telemetering Conference Proceedings / October 25-28, 1999 / Riviera Hotel and Convention Center, Las Vegas, Nevada / To meet specific test and evaluation requirements, the Hardened Subminiature Telemetry and Sensor Systems (HSTSS) program is addressing the miniaturization and ‘G’ hardening of telemetry components. Two custom Integrated Circuits (ICs) are in development to support the design of miniature Pulse Code Modulation (PCM) systems with up to 128 analog input channels. This paper describes the design and development of the custom IC chips of the HSTSS Data Acquisition Chipset (DAC). The original requirements, the roll of the Integrated Product Team (IPT), design decisions, a discussion of the additional features, and practical limitations of the Data Acquisition Chipset will be covered.