High performance communications, sensing and computing systems are growing exponentially as modern life continues to rely more and more on technology. One of the factors that are currently limiting computing and transmission speeds are copper wire interconnects between devices. Optical fiber interconnects would greatly increase the speed of today’s electronic devices. In this study it has been demonstrated that by using a new Direct Print Additive Manufacturing (DPAM) process of Fused Deposition Modeling (FDM) of plastic and micro-dispensing of pastes and inks, we can 3D print single and multi-mode optical fibers in a controlled manner such that compact, 3-dimensional optical interconnects can be printed along non-lineal paths. We are FDM printing the core materials from a plastic PMMA material. We are dispensing a urethane optical adhesive as the core material. These materials are available in many different refractive indices. During numerical simulations of these fibers, we were able to show through manipulation of the refractive indices of the core and cladding that we can also improve the bend performance of our fibers. As a result, they can perform better as an interconnect in tight routings between components as long as the interconnect fiber distances remain less than 1 meter. Fibers have been fabricated with diameters between 77 and 17 µm across an air gap with a surface roughness of less than 450 nm and cladded and tested with transmission rates of about 46%. 12 µm fibers have successfully been fabricated on a cladded surface as a proof of concept to test the small diameter and 3D shaping capability of this process.

Two methods of dielectric characterization are presented that offer quick and cost-effective solutions for screening complex dielectric material properties. Through Direct-Print Additive Manufacturing (DPAM) methods, a dielectric material of choice is dispensed into a capacitor structure and characterized through 1-port s-parameter measurements. The presented methods use fixtures that are modeled and validated through simulation then implemented in practice. Advanced simulations are performed to gain insights which are used to optimize the dielectric characterization performance of the fixtures. Additional investigations are performed which investigate the durability of the fixture and material within by exposing the combination to rough environmental conditions for an extended duration. The presented capacitor structures are investigated to characterize dielectric materials within the bandwidth of 0.1-15 GHz, saving the time and effort required in using multiple dielectric characterization methods that cover the same bandwidth. Both methods are compared based on the results for each method achieved in practice while considering the process required perform each method. The pros and cons of the presented characterization methods are weighed which highlights the key aspects for successfully characterizing dielectric materials with each method as well as revealing the potential limitations associated with each.