Die-stacking is a new technology that allows multiple integrated circuits to be stacked on top of each other while connected with a high-bandwidth and high-speed interconnect. In particular, die-stacking can be useful in boosting the effective bandwidth and speed of DRAM systems. Die-stacked DRAM caches have recently emerged as one of the top applications of die-stacking. They provide higher capacity than their SRAM counterparts and are faster than offchip DRAMs. In addition, DRAM caches can provide almost eight times the bandwidth of off-chip DRAMs. They, however, come with their own challenges. Since they are only twice as fast as main memory, they considerably increase latency for misses and incur significant energy overhead for remote lookups in snoop-based multi-socket systems. In this thesis, we present a Dual-Grain Filter for avoiding unnecessary accesses to the DRAM cache at reduced hardware cost and we compare it to recent works on die-stacked DRAM caches.

Die-stacking is a new technology that allows multiple integrated circuits to be stacked on top of each other while connected with a high-bandwidth and high-speed interconnect. In particular, die-stacking can be useful in boosting the effective bandwidth and speed of DRAM systems. Die-stacked DRAM caches have recently emerged as one of the top applications of die-stacking. They provide higher capacity than their SRAM counterparts and are faster than offchip DRAMs. In addition, DRAM caches can provide almost eight times the bandwidth of off-chip DRAMs. They, however, come with their own challenges. Since they are only twice as fast as main memory, they considerably increase latency for misses and incur significant energy overhead for remote lookups in snoop-based multi-socket systems. In this thesis, we present a Dual-Grain Filter for avoiding unnecessary accesses to the DRAM cache at reduced hardware cost and we compare it to recent works on die-stacked DRAM caches.