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Interfacial adhesion and subcritical debonding of low-k dielectrics in flip-chip-packaged copper/low-k interconnect structures /Miller, Mikel Rolf, January 2000 (has links)
Thesis (Ph. D.)--University of Texas at Austin, 2000. / Vita. Includes bibliographical references (leaves 165-169). Available also in a digital version from Dissertation Abstracts.
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