Differential signaling is suitable for high speed signal transmission due to lower noise induction and higher common-mode noise rejection compared to its single-ended signaling counterpart. However, for a high performance differential transmission-line pair, excellent symmetry and appropriate design for substrate layer stack-up is necessary. Especially for a practical IC package substrate, differential transmission-line pair is inevitable for asymmetry because of considering the locations of IC pads and solderballs. Furthermore, different differential transmission-line pair architectures are also demanded in consideration of limited substrate floorplan space and substrate layer stack-up structures. In this thesis, several differential pairs have been implemented on the conventional 4-layer laminate package substrate. The consequent high frequency performances are measured using vector network analyzer and then compared by converting into mixed-mode S-parameters.