This thesis focuses on the structures of plated through holes in organic substrate, and discusses the high-frequency electrical characteristics of various plated through hole structures. This thesis consists of four parts. The first part introduces various kinds of vias in multilayer substrate. This content includes substrate drilling processes and capabilities, and discussions on plated through hole structures and their manufacture concerns. The second part focuses on actual measurement of plated through holes, and introduces high-frequency double-side probing technique. The difference from traditional high-frequency coplanar probing measurement is also discussed. The third part focuses on the high-frequency simulation by full-wave software ¡V Ansoft HFSS, and discusses the effects of various excited source and model structures on simulations. Part4 focuses on developing the broadband equivalent circuit model based on the physical structures, and discusses the electrical characterization of different plated through holes, and provides the related design concept.