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Distributed Game Environment : A Software Product Line for Education and ResearchQuan, Nguyen January 2013 (has links)
A software product line is a set of software-intensive systems that share a common, managed set of features satisfying the specific needs of a particular market segment or demand. Software product lines capitalize commonality and manage variation to reduce the time, effort, cost and complexity when creating and maintaining products in a product line. Therefore reusing core assets, software product line can address problems such as cost, time-to-market, quality, complexity of developing and maintaining variants, and need to quickly respond to market’s demands. The development of a software product line is different from conventional software development and in the area of education and research of product line there is a lack of a suitable purposefully designed and developed software product line (SPL) that can be used for educational or research purposes. In this thesis we have developed a software product line for turn-based two players distributed board games environment that can be used for educational and research purposes. The software product line supports dynamic runtime update, including games, chat, and security features, via OSGi framework. Furthermore, it supports remote gameplay via local area network and dynamic runtime activity recovery. We delivered a product configuration tool that is used to derive and configure products from the core assets based on feature selection. We have also modeled the software product line’s features and documented its requirements, architecture and user guides. Furthermore, we performed functional and integration tests of the software product line to ensure that the requirements are met according to the requirements specification prescribed by the stakeholders.
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Microstructure Evolution in 304L Stainless Steel Subjected to Hot Torsion at Elevated TemperatureLu, Jian 19 September 2011 (has links) (PDF)
The current study focus on investigating a relationship between processing variables and microstructure evolution mechanism in 304L stainless steel subjected to hot torsion. The Gleeble 3800 with Mobile Torsion Unit (MTU) is utilized in the current study to conduct hot torsion test of 304L stainless steel. Samples are rotated at 1100℃ in the shear strain rate range of 0.02s-1 to 4.70s-1 and the shear strain range of 0.5 to 4. Orientation imaging microscopy (OIM) technique is used to collect and analyze the microstructure. At low strains (≤1) and strain rate (0.02s-1), average grain size remains relatively constant, but the lengths of DSs and LABs increase within grains. These are characteristics of the dynamic recovery (DRV). With increasing strain and strain rate, the lengths of DSs, LABs and HABs increase, accompanied by the decrease of average grain size. Subgrains with HAB segments are observed. These are characteristics of continuous dynamic recrystallization (CDRX). At strain rates greater than or equal to 0.94s-1, the fraction of deformation texture is about 3 times higher than that of rotated cube texture. The average grain size increases relative to that at a strain rate of 0.20s-1, accompanied by the increase of twin length per area. This indicates that grain growth take place after CDRX. Sigma phase is not observed in the current study due to the lack of static recrystallization (SRX) and the higher cooling rate.
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Deformation Behaviour, Microstructure and Texture Evolution of CP Ti Deformed at Elevated TemperaturesZeng, Zhipeng January 2009 (has links)
In the present work, deformation behavior, texture and microstructure evolution of commercially pure titanium (CP Ti) are investigated by electron backscattered diffraction (EBSD) after compression tests at elevated temperatures. By analysing work hardening rate vs. flow stress, the deformation behaviour can be divided into three groups, viz. three-stage work hardening, two-stage work hardening and flow softening. A new deformation condition map is presented, dividing the deformation behavior of CP Ti into three distinct zones which can be separated by two distinct values of the Zener-Hollomon parameter. The deformed microstructures reveal that dynamic recovery is the dominant deformation mechanism for CP Ti during hot working. It is the first time that the Schmid factor and pole figures are used to analyse how the individual slip systems activate and how their activities evolve under various deformation conditions. Two constitutive equations are proposed in this work, one is for single peak dynamic recrystallization (DRX), the other is specially for CP Ti deformed during hot working. After the hot compression tests, some stress-strain curves show a single peak, leading to the motivation of setting up a DRX model. However, the examinations of EBSD maps and metallography evidently show that the deformation mechanism is dynamic recovery rather than DRX. Then, the second model is set up. The influence of the deformation conditions on grain size, texture and deformation twinning is systematically investigated. The results show that {10-12} twinning only occurs at the early stage of deformation. As the strain increases, the {10-12} twinning is suppressed while {10- 11} twinning appears. Three peaks are found in the misorientation frequency-distribution corresponding to basal fiber texture, {10-11} and {10-12} twinning, respectively. A logZ-value of 13 is found to be critical for both the onset of {10-11} compressive twinning and the break point for the subgrain size. The presence of {10-11} twinning is the key factor for effectively reducing the deformed grain size. The percentage of low angle grain boundaries decreases with increasing Z-parameter, falling into a region separated by two parallel lines with a common slope and 10% displacement. After deformation, three texture components can be found, one close to the compression direction, CD, one 10~30° to CD and another 45° to CD. / QC 20100819
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