Thesis (Ph.D)--Mechanical Engineering, Georgia Institute of Technology, 2009. / Committee Chair: Joshi, Yogendra; Committee Member: Gallivan, Martha; Committee Member: Graham, Samuel; Committee Member: Yeung, Pui-Kuen; Committee Member: Zhang, Zhuomin. Part of the SMARTech Electronic Thesis and Dissertation Collection.

Thesis (M.S.)--Michigan State University. Dept. of Electrical Engineering, 2008. / Title from PDF t.p. (viewed on Aug. 5, 2009) Includes bibliographical references (p. 76-77). Also issued in print.

M.Phil. / This dissertation provides an overview on the problem of electronic component obsolescence from a military product support perspective. By assessing applicable literature as well as feedback and lessons learned from relevant support projects, a strategy for the management of component obsolescence is proposed. The aim of the research is to provide a definition of component obsolescence drivers and to formulate a strategy for the management of component obsolescence within a military electronic support environment. The strategy will give guidelines on how management activities can be optimised to reduce applicable obsolescence risks and thereby reducing related life cycle costs. In order to implement a successful obsolescence management process (OMP), the following approach is proposed: Ensure that the drivers of component obsolescence and the possible impact there of will be made visible to applicable levels of management. Promote an environment where obsolescence management is an integral part of the system engineering process so as to optimise the rapid electronic development process whilst also keeping support expenditure within acceptable limits. Encourage projects to support a process that is directed at addressing obsolescence risks applicable to that project. Introduce OMP as an important part of the Through Life Support (TLS) planning of projects. Materials management should be encouraged to implement a process where interfacing with suppliers will address obsolescence risks. This typically includes a feedback loop regarding component usage patterns, component end of production notifications, component substitutions and other related component supplier information. Adequate funding must be allocated to ensure that obsolescence risks and activities can be addressed cost effectively over the complete life cycle of the product or system from initial design to end of support.

Nesta tese é apresentado um novo método de desmontagem das placas de circuito impresso obsoletas ou defeituosas, provenientes de resíduos de equipamentos eletroeletrônicos, para aplicação no processo de reciclagem. A desmontagem tem por objetivo segregar a PCI para que o material reciclado apresente maior pureza, bem como facilitar as etapas posteriores no processo de reciclagem. A desmontagem proposta é classificada como automática, simultânea e destrutiva. O método apresentado não requer o uso de tecnologias avançadas e de alto custo. Para aplicação deste método foi desenvolvido um protótipo que utiliza aquecimento do ar para derretimento da solda e força centrífuga para remoção dos componentes. O desenho deste equipamento permite a separação da PCI em 3 partes distintas: substrato, solda e componentes eletrônicos. Para a desmontagem no protótipo foram usadas placas marrons de fontes de alimentação, e placas verdes de memórias tipo RAM, com substrato de fenolite e de fibra de vidro respectivamente. A desmontagem foi realizada com sucesso em ambos os casos. Para as placas pesadas ou marrons, a faixa de operação que apresentou maior taxa de recuperação de solda (entre 2,2 e 2,8% do peso da PCI) e de componentes (entre 60 e 80% do peso da PCI) situa-se entre 200 e 206°C e 900 rpm. Para placas leves ou verdes, a desmontagem deve se situar entre 210 e 225°C e 900 rpm, sendo a quantidade de solda recuperada inferior a 1% e a de componentes aproximadamente 32% do peso da PCI. A liga de solda recuperada dos dois tipos de placas possui contaminação abaixo de 3%, teor semelhante à da borra proveniente de processos industriais de soldagem e que é utilizada como matéria prima. / In this work, is presented a new method for disassembly of obsolete or defective printed circuit board, from waste of electrical and electronic equipmente, for use in recycling. Disassembly objetives separate PCB to achives purer recycled material as well facilited the subsequent step in recycling process. Proposed disassembly is classified as automatic, simultaneous and destructive. The presented method doesn\'t required the use of advanced and expensives technologies. For this method, a prototype was developed. It utilizes centrifugal force and air heating for solder melting and components removal. Design of the prototype allows separation of PCB in 3 parts: substrate, solder and electronics components. Very low grades boards of paper laminated phenolic resins, from power supply of computers was used, as well as very high grade boards from RAM memory, made of fiberglass. Disassembly was sucessfully for both cases. For very low grade boards, operation range which has a greater amount of recovered solder (between 2,2 and 2,8% of weight of PCB) and components (between 60 and 80% of weight of PCB) is inside the range of temperature of 200 and 206°C and 900 rpm. For very high grade boards, disassembly is inside the range of temperature of 210 and 225°C and 900 rpm, with quantity of recovered solder under 1% and components aproximatelly 32% of weight of the PCB. Recovery solder for the two kinds of PCB has a contamination under 3%, similar to spare from industrial welding process, used as input in the production of new solders.

Thesis (Sc.D.)--Massachusetts Institute of Technology, Dept. of Nuclear Engineering, 1982. / MICROFICHE COPY AVAILABLE IN ARCHIVES AND SCIENCE. / Vita. / Includes bibliographical references. / by Michael Peter Manahan. / Sc.D.

Over the past decade, the satellite industry has witnessed the birth and evolution of the CubeSat standard, not only as a technology demonstrator tool but also as a human capacity development platform in universities. The use of commercial off the shelf (COTS) hardware components makes the CubeSat a cost effective and ideal solution to gain access to space in terms of budget and integration time for experimental science payloads. Satellite operations are autonomous and are essentially based on the interaction of interconnected electronic subsystems exchanging data according to the mission requirements and objectives. The onboard computer (OBC) subsystem is developed around a microcontroller and plays an essential role in this exchange process as it performs all the computing tasks and organises the collection of onboard housekeeping and payload data before downlink during an overpass above the ground station. The thesis here presented describes the process involved in the development, design and implementation of a prototype OBC for a CubeSat. An investigation covering previously developed CubeSat OBCs is conducted with emphasis on the characteristics and features of the microcontroller to be used in the design and implementation phases. A set of hardware requirements are defined and according to the current evolution on the microcontroller market, preference is given to the 32-bit core architecture over both its 8-bit and 16-bit counterparts. Following a well defined selection process, Atmel’s AT91SAM3U4E microcontroller which implements a 32-bit Cortex-M3 core is chosen and an OBC architecture is developed around it. Further, the proposed architecture is implemented as a prototype on a printed circuit board (PCB), presenting a set of peripherals necessary for the operation of the OBC. Finally, a series of tests successfully conducted on some of the peripherals are used to evaluate the proposed architecture.

The purpose of this project was to develop two-semester unit plans for the auto electronics course in the automotive technology program at Fontana High School.

No description available.

No description available.

This thesis aims to analyze legislation on the management of electrical, electronic equipment and E-Waste, especially also solar panels. The object of the research is European legislation from its follows Czech legislation. The focus of the thesis is the chapter dealing with the life cycle of the electrical, electronic equipment and operators involved in the life cycle of electrical, electronic equipment. The main Act is Waste Act No. 185/2001 Coll. Powered by TCPDF (www.tcpdf.org)