This thesis proposes a new bandpass filter prototype modified based on T-type coupled resonator architecture by considering the parasitic shunt capacitance effect. After derivation, the new prototype can be proved equivalent to third-order Chebyshev bandpass filter. It is easy to realize the new prototype circuit by utilizing the inductor and capacitor library established from electromagnetic simulations. The couplings between circuit components can cause some transmission zeros to enhance attenuation rate at stopbands. This thesis designs several bandpass filters embedded in 4-layer laminate package substrate with center frequency at 2.45GHz. The measurement results show that most of these filters can achieve less than 1.7dB insertion loss and more than 14dB return loss at passband, and more than 30dB attenuation at 950MHz, 4.8GHz and 7.2GHz. One of the filters has a size of 1.9¡Ñ2.7mm2, which is the smallest area for the currently reported bandpass filters embedded in the organic package substrate.

This dissertation studies and implements highly miniaturized bandpass filter designs for wireless System-in-Package (SiP) applications. Based on the coupling matrix synthesis method, the external quality factors and coupling coefficients can be extracted by selecting the proper tapped-line feeding position and coupling spacing in geometrical configuration. Despite their high performance, most conventional microstrip bandpass filter designs require a bulky area for achieving, making them difficult to implement SiP applications. This dissertation first develops a stacked LC resonator and a stacked spiral resonator (SSR) in an embedded passive substrate (EPS) for realizing miniature single- and multi-band bandpass filters. Moreover, multiple transmission zeros created on both sides of each passband provide high stopband roll-off rates. The designed performance and size are comparable to those of low-temperature co-fired ceramic (LTCC) bandpass filters. As another conventional means of implementing RF passive components, the integrated passive device (IPD) process can produce large-value inductors and high-density capacitors, simultaneously. This dissertation fully utilizes the advantages of IPD technology to implement very compact bandpass filter designs with multiple transmission-zero frequencies at stopband by using a high-density wiring planar transformer configuration. Furthermore, due to the fully symmetric geometry, the transformer-coupled bandpass filter can be easily converted into a balun bandpass filter, capable of providing a superior balance performance with a significantly higher common mode rejection ratio (CMRR) level. The electromagnetic (EM) simulation results, as obtained by using Ansys-Ansoft HFSS, agree with the measurement results for all of the proposed designs in this dissertation.