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  • About
  • The Global ETD Search service is a free service for researchers to find electronic theses and dissertations. This service is provided by the Networked Digital Library of Theses and Dissertations.
    Our metadata is collected from universities around the world. If you manage a university/consortium/country archive and want to be added, details can be found on the NDLTD website.
1

Mechanical properties of aluminum-filled epoxies

Shinde, Sham Ambaji, 1942- January 1971 (has links)
No description available.
2

A correlation between morphology and fracture properties of epoxy resins

Mijović, Jovan S., January 1978 (has links)
Thesis--University of Wisconsin--Madison. / Typescript. Vita. eContent provider-neutral record in process. Description based on print version record. Includes bibliographical references (leaves 244-274).
3

Properties of epoxy resin joints in masonry materials

Martinez-Pereda, Pedro. January 1962 (has links)
Thesis (M.S.)--University of Wisconsin--Madison, 1962. / Typescript. eContent provider-neutral record in process. Description based on print version record. Includes bibliographical references (leaves 65).
4

Effects of processing and environmental conditions on the properties of epoxy materials

Ottemer, Xavier 05 1900 (has links)
No description available.
5

Miscibility predictions in polymer blends

Milner, V. A. January 1992 (has links)
No description available.
6

Cure behavior of epoxy polymers used in microelectronics /

Taweeplengsangsuke, Jantrawan, January 2000 (has links)
Thesis (Ph. D.)--Lehigh University, 2000. / Includes vita. Includes bibliographical references (leaves 220-231).
7

Understanding the strength of epoxy-polyimide interfaces /

Hoontrakul, Pat January 2003 (has links)
Thesis (Ph. D.)--Lehigh University, 2003. / Includes bibliographical references and vita.
8

The use of epoxy resin compounds as a shear connector in composite beam construction

Ankeny, Robert Allen, 1942- January 1966 (has links)
No description available.
9

Correlation between the dielectric, rheological and structural properties of DGEBA-DDS epoxy

Ratnam, Mamatha D. 08 1900 (has links)
No description available.
10

Thermoelastic stress analysis for an encapsulated silicon chip interface

Shepherd, Russell D. 05 1900 (has links)
No description available.

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